FormFactor top probe card supplier for three consecutive years
FormFactor Enables Accurate Testing of Ultrasmall Microchips
The smaller semiconductor microchips become, the more difficult it is to test them. Founded in a New York lab in 1993, FormFactor had foreseen early on this trend towards miniaturisation that it focused its research and development (R&D) on creating one of the world’s most ...
Reliable Testing of Cu Pillar Technology for Smart Devices
he relentless drive for greater functionality and performance i n s m a r t p h o n e s , t a b l e t s and other consumer devices requires a higher level of chip integration, which in turn, requires increasing ...
Test Challenges Grow
Experts at the table, first of three parts: New techniques for reducing cost; limitations of existing approaches; what’s changed and future challenges.
Semiconductor Engineering sat down to discuss current and future test challenges with Dave Armstrong, director of business development at Advantest; Steve Pateras, product marketing ...
TSVs: Welcome To The Era Of Probably Good Die
Physical probing of devices using TSVs is proving a challenge to traditional test.
Among the challenges of a widespread adoption of 3D ICs is how to test them, particularly when it comes to through-silicon vias (TSVs). While not necessarily presenting a roadblock, TSVs use in the ...
FormFactor Tackles Probe Test for 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013.
For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing ...
Chip Test Equipment Maker MicroProbe Doubles Revenue
Final Test Report: Focus on MicroProbe
Wafer Probe & Copper Pillars: Challenges & Solutions Viewpoint by MicroProbe CEO, Dr. Mike Slessor