December 2007

FormFactor Unveils New Addition to Wire Bond Logic Probe Card Family to Lower IC Test Costs for Mobile and Consumer Applications

LIVERMORE, Calif. – December 4, 2007 – FormFactor, Inc. (Nasdaq: FORM) today announced the latest addition to its TrueScaleTM probe card family for wire bond system-on-chip (SoC) devices. Offering scalability down to 40 micron pad pitch, the TrueScale PP40 wafer probe card is designed to ...

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December 2007

FormFactor to Present at the Lehman Brothers Technology Conference

LIVERMORE, Calif. – December 3, 2007 – FormFactor, Inc. (Nasdaq: FORM) is pleased to announce its participation in the Lehman Brothers Technology Conference on Wednesday, December 5, 2007. The company’s chief financial officer, Ron Foster, will make a presentation to the financial community at 1:30 ...

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