Contact Us
';
[featured_image]
  • Version
  • Download 9840
  • File Size 1.82 MB
  • File Count 1
  • Create Date September 3, 2021
  • Last Updated September 3, 2021

Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probe Cards

Semiconductor manufacturers are on a relentless drive to reduce the total cost of test at sort. A major contributor to reducing cost of test is increasing simulations Device Under Test which requires a subsequent increase in the probe card active area. FormFactor has developed a new probe card architecture to address the challenges of fine pitch, high CCC, and high temperature range for wire bond probing applications.

Attached Files

FileAction
challenges-of-expanding-large-area-active-array-for-fine-pitch-vertical-probe-cards.pdfDownload
;