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application/pdfIEEE2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS);2019; ; ; 3DICmicro-bumpsbumpsdaisy-chain4-point KelvinKelvinresistancewafer surface leakage measurementswafer acceptance testsWATand IC packagingCharacterization of Micro-Bumps for 3DIC Wafer Acceptance TestsChoon Beng Sia
2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)180 March 2019183
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