MEMS Probe Technology for Fine-pitch Cu Pillar Bump Wafer Sort Test

In this paper, FormFactor’s Alan Liao lookas at SoC chip packaging trends and the driving force of CuPillar packaging. The presentation includes the test challenges of fine pitch CuPillar HVM probing, and the need for MEMS probe technology for fine pitch CuPillar HVM testing.

- MEMS Probe Technology for Fine-pitch Cu Pillar Bump Wafer Sort Test

Created: August 31, 2018 | Updated: June 25, 2020 | Type: pdf | Size: 2.95 MB