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SiP/SoC P-Series Pyramid Probe Card Data Sheet

Advanced logic (SiP/SoC) production probe card solutions reduce the cost of test through enhanced throughput, reduced maintenance and increased yields; enabled through large multi-DUT probe surfaces, permanent probe alignment, superior electrical performance and long life. Pyramid Probe cards are designed for both bond pad and flip chip bump applications. Pyramid SiP/SoC logic probe card product line allows at-speed testing of large scale ICs at die sort.

SiP/SoC P-Series Pyramid Probe Card Data Sheet

Created: August 23, 2017 | Updated: May 15, 2018 | Type: pdf | Size: 2.35 MB

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