Flexible Multi-sensor Metrology Tool for Advanced Packaging
MicroProf® AP Overview
The FRT MicroProf® AP is a fully automated wafer metrology tool for a wide range of applications at different 3D packaging process steps, e.g. for the measurement of photoresist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as for the measurement in thinning, bonding and stacking processes. With its modular multi-sensor concept, the flexible MicroProf AP measuring tool is ideally suited to perform a variety of measuring tasks in advanced packaging.
The FRT MicroProf AP also provides comprehensive measurement solutions for backside processing (backgrinding, metallization) for power semiconductors such as MOSFET or IGBT, as well as for the control of different substrates, e.g. bulk Si, SOI, cavity SOI, compounds such as GaAs, InP, SiC, GaN, ZnO, and also for transparent materials. Furthermore, it can be used for hybrid bonding and Micro Electro Mechanical Systems (MEMS), included in consumer electronics, automotive, telecom, medical and industrial markets.
Learn more about metrology applications in advanced packaging!
MicroProf® AP Key Features
- Flexible multi-sensor metrology tool for advanced packaging
- For every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking, and molding
- Wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
- Individual configuration for your specific applications
- Retrofit on demand
Fuly Automated Wafer Metrology Tools FRT MicroProf with EFEM
The standard fully automated wafer Metrology Tools – MicroProf® FE / FS / AP / DI - combine the capabilities of the worldwide established MicroProf 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and long-lasting components, the MicroProf with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive defect inspection applications (DI).
FRT Metrology - TTV Bow Warp Measurement
TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.
FRT Metrology - Bump Measurements
With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.
FRT Metrology - Bonded Wafer Measurement
If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.
FRT Metrology - Thin Film Multi-layer Measurement
With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.
FRT Metrology - Wafer Handling with Flip Station
The flip station is a new component in our MicroProf® with EFEM handling equipment and can rotate a wafer by 180 degrees so that the bottom side of the wafer then faces upwards. This allows fully automatic measurement of both the top and bottom of a wafer within one handling process. The rotation of the wafer is relevant for the determination of the wafer bow according to SEMI standard MF 1390. This standard provides for bow measurements both in the original and in the rotated state of the wafer in order to take into account or compensate for the curvature of the wafer (bow) due to its own weight.
FRT Metrology - Measuring Thin High Bow Wafers
FRT Metrology Tool with integrated Bernoulli and vacuum chuck (developed by FRT) can handle extremely thin high bow wafers for measurement purposes, where the wafer needs to be flattened. To effectively handle different sizes and types of wafers, different kinds of end effectors are required. To facilitate this, a specially designed dual end effector changing station with eight slots is integrated in the tool.