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  • MicroProf DI Metrology System
  • MicroProf DI Metrology System
  • MicroProf DI Metrology System

The FRT MicroProf DI optical inspection tool, enables inspection of structured and unstructured wafers during the entire manufacturing process. By combining 2D inspection and metrology, the MicroProf DI provides measurement solutions for a variety of applications, including defect inspection and wafer-level metrology for micro-bumps, RDL, overlay and through silicon via (TSV) in a single measuring tool.

The MicroProf DI includes several modules that can be flexibly combined on the same tool platform, covering all wafer surfaces at high throughput for efficient process control. The modules include optical inspection and classification of defects via single-shot and step camera module, review of defects via a high-precision microscope and comprehensive multi-sensor metrology with different topography and layer thickness sensors. For the optical, non-contact and non-destructive analysis of hidden structures and inclusions in the wafer, interferometric layer thickness sensors with infrared light source and an IR microscope are also available.

MicroProf DI Metrology System

  • High-precision optical surface inspection for semiconductor applications
  • Metrology and Inspection flexibly combined in one fully automated platform
  • Defect inspection with single shot module, step camera and microscope station
  • Fast and reliable inspection of defects down to sub-μm range
  • Dark field micro inspection and bright field macro inspection

Fully Automated Wafer Metrology Tools FRT MicroProf with EFEM

The standard fully automated wafer Metrology Tools – MicroProf® FE / FS / AP / DI - combine the capabilities of the worldwide established MicroProf 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and long-lasting components, the MicroProf with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive defect inspection applications (DI).


FRT Metrology - TTV Bow Warp Measurement

TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.


FRT Metrology - Bump Measurements

With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.


FRT Metrology - Bonded Wafer Measurement

If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.


FRT Metrology - Thin Film Multi-layer Measurement

With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.


FRT Metrology - Wafer Handling with Flip Station

The flip station is a new component in our MicroProf® with EFEM handling equipment and can rotate a wafer by 180 degrees so that the bottom side of the wafer then faces upwards. This allows fully automatic measurement of both the top and bottom of a wafer within one handling process. The rotation of the wafer is relevant for the determination of the wafer bow according to SEMI standard MF 1390. This standard provides for bow measurements both in the original and in the rotated state of the wafer in order to take into account or compensate for the curvature of the wafer (bow) due to its own weight.


FRT Metrology - Measuring Thin High Bow Wafers

FRT Metrology Tool with integrated Bernoulli and vacuum chuck (developed by FRT) can handle extremely thin high bow wafers for measurement purposes, where the wafer needs to be flattened. To effectively handle different sizes and types of wafers, different kinds of end effectors are required. To facilitate this, a specially designed dual end effector changing station with eight slots is integrated in the tool.