Multi-sensor Technology and Hybrid Metrology for MEMS and Foundries
MicroProf® FS Overview
The FRT MicroProf® FS is a fully automated wafer metrology tool, configurable for a wide range of applications in the wafer foundry, using both standard and customized solutions.
Flexibility and versatility are keywords when it comes to metrology solutions for today’s silicon foundry applications. MicroProf FS provides a modular approach to create a fully automated multi-sensor tool that can solve all required measurement tasks. That’s why we call it the Foundry Star!
For its core metrology component, the proven FRT MicroProf 300 multi-sensor metrology tool is used to allow the measurement of different products and – by using a hybrid metrology concept – enhances the precision of measurements on samples where a single sensor or measuring principle is just not enough. The measurement system of the MicroProf FS is equipped with a granite base setup, with a three-point sample fixture or a vacuum chuck.
MicroProf® FS Key Features
- Fully automated multi-sensor technology and hybrid metrology setup for MEMS and Foundries
- Customizable for a wide range of applications within the Wafer Foundry
- Standardized hardware components integrated in customer-specific metrology solutions
- Handling of diverse substrate types
- Powerful inhouse software for fully automated 2D and 3D surface metrology
Fully Automated Wafer Metrology Tools FRT MicroProf with EFEM
The standard fully automated wafer Metrology Tools – MicroProf® FE / FS / AP / DI - combine the capabilities of the worldwide established MicroProf 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and long-lasting components, the MicroProf with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive defect inspection applications (DI).
FRT Metrology - TTV Bow Warp Measurement
TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.
FRT Metrology - Bump Measurements
With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.
FRT Metrology - Bonded Wafer Measurement
If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.
FRT Metrology - Thin Film Multi-layer Measurement
With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.
FRT Metrology - Wafer Handling with Flip Station
The flip station is a new component in our MicroProf® with EFEM handling equipment and can rotate a wafer by 180 degrees so that the bottom side of the wafer then faces upwards. This allows fully automatic measurement of both the top and bottom of a wafer within one handling process. The rotation of the wafer is relevant for the determination of the wafer bow according to SEMI standard MF 1390. This standard provides for bow measurements both in the original and in the rotated state of the wafer in order to take into account or compensate for the curvature of the wafer (bow) due to its own weight.
FRT Metrology - Measuring Thin High Bow Wafers
FRT Metrology Tool with integrated Bernoulli and vacuum chuck (developed by FRT) can handle extremely thin high bow wafers for measurement purposes, where the wafer needs to be flattened. To effectively handle different sizes and types of wafers, different kinds of end effectors are required. To facilitate this, a specially designed dual end effector changing station with eight slots is integrated in the tool.