Multi-sensor Metrology Tool in a Table-top Unit
MicroProf® 100 Overview
The FRT MicroProf® 100 is the universal surface metrology tool for quick and easy determination of topography, film thickness and sample thickness. As a compact table-top unit, and thus the smallest member of the MicroProf multi-sensor family, the MicroProf 100 offers the full flexibility of its bigger brothers. It is based on our proven SurfaceSens technology, in which different optical measurement methods – which otherwise can only be found in individual solutions– are merged into a universal and space-saving device.
In addition, the FRT MicroProf 100 can be equipped with the TTV option for double-sided sample inspection. This allows you to measure the top and bottom of the sample simultaneously and determine the sample thickness during the same measurement process. Due to its modular design, this metrology tool can be tailored to your specific application. In addition to the various sensors which can be added, the software can also be individually configured, and measurement tasks can be performed either manually or automatically.
MicroProf® 100 Key Features
- Tabletop unit with robust housing
- Based on the established FRT multi-sensor technology
- TTV option for double-sided sample inspection possible
- Integrated CCD camera with add-on illumination
- Motorized sensor approach with high-precision axis
- Simple and efficient control with FRT Acquire Software
- User-friendly FRT Mark III evaluation software with numerous evaluation and display options according to DIN-EN-ISO and SEMI standards
- Fully automated film thickness measurements through FRT Acquire Automation XT metrology software
FRT Metrology Tools MicroProf® 100 / 200/ 300
With the third generation of multi-sensor metrology tools, the MicroProf® is established with more than 700 installed platforms worldwide in optical surface measurement. The MicroProf enables for a wide range of measurement tasks which can be carried out quickly, efficiently, and intuitively. The MicroProf has impressed customers in the semiconductor, medical and automotive industries. They are also at home in the MEMS/NANO/MST, sapphire, photovoltaic, engineering, optics, and packaging industries.
FRT Metrology - TTV Bow Warp Measurement
TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.
FRT Metrology - Bump Measurements
With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.
FRT Metrology - Bonded Wafer Measurement
If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.
FRT Metrology - Thin Film Multi-layer Measurement
With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.