Universal, stand-alone metrology tool
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Universal, stand-alone metrology tool
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The FRT MicroProf® 200 is a high-performance measuring device for contactless and non-destructive characterization of almost all surfaces and films. This surface measuring tool is based on our established SurfaceSens technology and can perform numerous measuring tasks within just one system. A high-resolution CWL sensor allows for easy and reliable measuring of many parameters, e.g. topography, roughness, and contour. With a wide range of additional sensors, it is also possible to adapt the MicroProf 200 individually to your measuring task. Using the TTV module for inspection from both sides or using the module for automatic sample handling (MHU), the MicroProf 200 can also be retrofitted easily to your new measurement requirements at any time. With these capabilities, the tool can meet the highest automation requirements.
FRT Metrology Tools MicroProf® 100 / 200/ 300
With the third generation of multi-sensor metrology tools, the MicroProf® is established with more than 700 installed platforms worldwide in optical surface measurement. The MicroProf enables for a wide range of measurement tasks which can be carried out quickly, efficiently, and intuitively. The MicroProf has impressed customers in the semiconductor, medical and automotive industries. They are also at home in the MEMS/NANO/MST, sapphire, photovoltaic, engineering, optics, and packaging industries.
FRT Metrology - TTV Bow Warp Measurement
TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.
FRT Metrology - Bump Measurements
With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.
FRT Metrology - Bonded Wafer Measurement
If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.
FRT Metrology - Thin Film Multi-layer Measurement
With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.