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MicroProf 300 Metrology System
  • MicroProf 300 Metrology System
  • MicroProf 300 Metrology System
  • MicroProf 300 Metrology System
  • MicroProf 300 Metrology System

The FRT MicroProf® 300 is part of the high-performance and versatile MicroProf generation and features our established SurfaceSens technology. The tool is particularly useful in quality assurance, development and manufacturing, where the smallest deviations from the ideal surface shape must be determined contact-free without destroying the sample, with surface precision down to the sub-μm range. Besides roughness of the sample surface, shape is one of the most important parameters. Narrow tolerances must be precisely determined. The FRT MicroProf 300 is perfect for these requirements and can also be integrated into fully automated production. An extensive range of sensors and the option of conducting double-sided sample inspections (TTV) make it possible to individual adapt the MicroProf 300 to suit your measuring task at any time. Furthermore, the simple automation of measurements boosts productivity and process reliability.

MicroProf 300 Metrology System

  • Full range of multi-sensor setups usable
  • Integrated camera with add-on illumination
  • Control and measurement computer with TFT monitor
  • Motorized sensor approach with high-precision axis
  • Vertical stitching function to expand the height measuring range
  • Fast xy precision table with high motion and positioning accuracy
  • Stable granite construction with excellent damping properties
  • Simple and efficient control with FRT Acquire software
  • Fully automated 2D and 3D measurements through FRTs Acquire Automation XT metrology software
  • User-friendly FRT Mark III evaluation software with numerous evaluation and display options according to DIN-ISO and SEMI standards

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FRT Metrology Tools  MicroProf® 100 / 200/ 300

With the third generation of multi-sensor metrology tools, the MicroProf® is established with more than 700 installed platforms worldwide in optical surface measurement. The MicroProf enables for a wide range of measurement tasks which can be carried out quickly, efficiently, and intuitively. The MicroProf has impressed customers in the semiconductor, medical and automotive industries. They are also at home in the MEMS/NANO/MST, sapphire, photovoltaic, engineering, optics, and packaging industries.


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FRT Metrology - TTV Bow Warp Measurement

TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.


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FRT Metrology - Bump Measurements

With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.


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FRT Metrology - Bonded Wafer Measurement

If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.


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FRT Metrology - Thin Film Multi-layer Measurement

With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.