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  • MicroProf TL Metrology System
  • MicroProf TL Metrology System

The FRT MicroProf® TL is an optical surface measurement tool for fully automatic 3D surface measurements. Unique from other family members of the FRT MicroProf series, the TL features a Thermo Unit – a fully integrated heating and cooling stage – as well as a DLS deformation sensor by Chemnitzer Werkstoffmechanik. With these features, MicroProf TL can be used to characterize lateral and vertical deformation of samples under thermal load. This can be used to determine the behavior of components under working condition or to simulate various process steps. For the measurement process temperature cycles can be set as required by an easy recipe creation.

In combination with the software Acquire Automation XT, the MicroProf TL can run fully automatic temperature profiles. In the recipe, the user can set target temperatures, temperature ramps and dwell time that will be used during process. Set points can be defined where topography and deformation measurements take place within the heating/cooling process. Permanent temperature logging is available, and optionally, a second temperature probe can be added to monitor the temperature at special locations on the sample.

MicroProf TL Metrology System

  • Optical surface metrology tool with fully integrated heating and cooling stage
  • Programmable temperature control from 10°C to 400°C
  • High heating and cooling rate
  • Temperature stability: < 1°C

FRT Metrology Tools  MicroProf® 100 / 200/ 300

With the third generation of multi-sensor metrology tools, the MicroProf® is established with more than 700 installed platforms worldwide in optical surface measurement. The MicroProf enables for a wide range of measurement tasks which can be carried out quickly, efficiently, and intuitively. The MicroProf has impressed customers in the semiconductor, medical and automotive industries. They are also at home in the MEMS/NANO/MST, sapphire, photovoltaic, engineering, optics, and packaging industries.


FRT Metrology - TTV Bow Warp Measurement

TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.


FRT Metrology - Bump Measurements

With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.


FRT Metrology - Bonded Wafer Measurement

If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.


FRT Metrology - Thin Film Multi-layer Measurement

With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.