FRT
MicroProf® MHU
Material Handling Unit with dual-arm robot for the semiconductor, MEMS, and LED industries
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The FRT MicroProf® MHU metrology tool with Material Handling Unit, is specially designed for the semiconductor, MEMS, sapphire, and LED industries. Typical applications are measurements of bare and coated, as well as structured wafers at various lithographic process steps. Due to a robotic arm with two vacuum end effectors, the tool has very high throughput rates of up to 220 wafers per hour. It is capable of processing wafer sizes from 2 to 8 inches. Up to 4 open cassettes can be processed and, additionally, there is the option to integrate a pre-aligner and an OCR reader.
The option for two-sided sample measurement allows the simultaneous measurement of the top and bottom surface with determination of the sample thickness, total thickness variation (TTV) and various surface parameters such as roughness, waviness and flatness of both sides. A complete wafer shape measurement is also possible with analysis of the global and local wafer parameters. A wafer sorting function is available, which is adjustable according to customer requirements. Based on SurfaceSens technology, additional sensors can be retrofitted later. A further application of the MicroProf MHU is the layer thickness determination of thin films, as well as layer stacks, measurement of step heights, bumps, vias (TSVs), trenches, etc.
With its fully SEMI-compliant design, robust hardware components and high throughput, the FRT MicroProf MHU is the perfect metrology solution for production use.
- Material Handling Unit with dual arm vacuum grabber
- Optional edge handling and/or non-contact handling
- Different wafer sizes (from 2 up to 8 inches) in the same tool
- Optional OCR reader and pre-aligner
- Maximum flexibility thanks to multi-sensor setup
- Simultaneous measurement on both wafer sides (TTV)
- Fully automated recipe operation with FRT Acquire Automation XT software
- Optional SECS/GEM interface
- Sample sorting function, set up according to customer requirements
- Optional filter fan units, ISO class 4 clean room condition
FRT Metrology - MicroProf® MHU
The Metrology Tool MicroProf® MHU has been specially designed for the semiconductor, MEMS and LED industry and can be easily configured for various sample (wafer) types. Many industrial applications require fully automated measurements with high throughput. This, in turn, requires automatic handling of the samples. The handling unit can handle wafer sizes between 2 and 8 inches. Depending on the configuration, up to four cassettes can be processed simultaneously.
FRT Metrology - TTV Bow Warp Measurement
TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, we show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.
FRT Metrology - Bump Measurements
With bump measurement, the bumps of selected dies can be determined. In this application video, we show you the typical steps of a bump measurement recipe: automatic fine-alignment using high-resolution positioning camera, fast auto approach and measurement at selected die, measurement preview, retract sensor to safe height and move wafer to load position, automatic reporting of measurement results and data charts.
FRT Metrology - Bonded Wafer Measurement
If you execute the automated measurement of a bonded wafer, the full sample thickness and the thickness of each single layer will be determined. In this application video, we show you the typical steps of a bonded wafer recipe: thickness calibration, full sample thickness, single layer thickness of silicon, glass and glue, automatic reporting of measurement results and data charts.
FRT Metrology - Thin Film Multi-layer Measurement
With our metrology tools, we can measure simultaneously thin-film multi-layers. In this application video, we show you the typical steps of a thin-film multi-layer measurement recipe: sensor referencing, simultaneous point measurements of multiple layers, preview of silicon oxide and silicon nitride thickness, automatic reporting of measurement results and data charts.
