Metrology - Advanced Packaging Applications
Chip packaging techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, are all methods of advanced packaging. With advanced packaging, the need for flexibility in wafer metrology and handling has just exploded.
FRT Metrology Tools measure and handle numerous wafer types up to 12 inches for both front and back end: bare, structured, coated, bonded, highly warped, thinned, TAIKO and fan-out wafers, even wafers with Micro-Electronic-Mechanical components or at different 3D packaging process steps, but also glass, lens, and non-SEMI-standard wafers, panels and film frames.
The included dual arm robot handling unit can be configured for 300 mm, 200 mm, and 150 mm wafers and panels, both exclusive or as a bridge tool allowing the handling of two sample sizes within one metrology tool.
Our FRT MicroProf® AP system is specifically designed for metrology advanced packaging applications.
Our SurfaceSens multi-sensor technology, the modular based software and the retrofittable sensor hardware create the flexibility customers need in heterogeneous production cycles.
Below you will find a selection of typical FRT Metrology applications, illustrated to show sensor setup and two measurement images and/or graphs.