Metrology - MST/MEMS/Nano Applications
Mechanical parts and electronic circuits combine to form miniature devices, typically on a semiconductor chip, with dimensions from tens of micrometers to a few hundred micrometers. Common applications for MEMS include sensors, actuators, and process-control units. MEMS are the drivers of the IoT (Internet of Things).
Manufacturers in the fields of microelectronics and microsystems have high demands on the production tolerances of the pre-product “wafer”. Even small deviations can have a negative impact on the quality in the downstream, cost-intensive process steps.
Wafer measurement requires a high degree of precision. FRT Metrology Tools measure and handle numerous wafer types up to 12 inches for both front and back end: Bare, structured, coated, bonded, highly warped, thinned, TAIKO and fan-out wafers, even wafers with Micro-Electronic-Mechanical components or at different 3D packaging process steps, but also glass, lens, and non-SEMI-standard wafers, panels and film frames.
Our SurfaceSens technology, the modular based software and the retrofittable sensor hardware create the flexibility customers need in heterogeneous production cycles.
Below you will find a selection of typical FRT metrology applications to show sensor setup and two measurement images and/or graphs.