Metrology - Semiconductor Applications
Wafers are the substrate to manufacture semiconductors. Surface Metrology on wafers made of various conductive or non-conductive materials such as silicon, sapphire, or glass with a typical diameter of 100, 150, 200 or 300 mm is essential for quality assurance.
Manufacturers in the fields of semiconductor have high demands on the production tolerances of the pre-product “wafer”. Even small deviations can have a negative impact on the quality in the downstream, cost-intensive process steps.
High-quality, fully automated multi-sensor FRT Metrology technology contributes to the control of process tolerances in wafer manufacturing and helps to maintain the required quality standards of the producers.
Wafer measurement requires a high degree of precision. FRT Metrology tools measure and handle numerous wafer types up to 12 inches for both front and back end: Bare, structured, coated, bonded, highly warped, thinned, TAIKO and fan-out wafers, even wafers with Micro-Electronic-Mechanical components or at different 3D packaging process steps, but also glass, lens, and non-SEMI-standard wafers, panels and film frames.
The included dual arm robot handling unit can be configured for 300 mm, 200 mm, and 150 mm wafers and panels, both exclusive or as a bridge tool allowing the handling of two sample sizes within one metrology system.
Our SurfaceSens technology, the modular based software and the retrofittable sensor hardware create the flexibility customers need in heterogeneous production cycles.
Below you will find a selection of typical FRT metrology applications, illustrated to show sensor setup and two measurement images and/or graphs.