Partnering with Customers to
At FormFactor, we partner with technology leaders to optimize device performance, advance yield knowledge, and improve product output. Our collaborations extend from application development and pre-production phase, to design and volume manufacturing. By taking advantage of our expertise, solutions and infrastructure, our customers can drive continuous innovation with greater control and fewer economic risks. By collaborating with FormFactor to protect and enhance performance and device yield, developers, designers and manufacturers of next-generation devices can accelerate their time-to-market and their profitability.
We support our customers at all major phases
in design through production.
Our design-to-test collaborative approach is an imperative enabler of advanced ICs, especially with the compressed time-to-market demands of today’s automotive and mobile markets. Central to our approach is advanced technology and expertise, where we not only help customers manufacture their current products, we also help them innovate and build the products of tomorrow. This means applying our decades of industry knowledge and experience to solve technical and cost challenges before a complicated design starts production, and well before first silicon reaches the test floor.
We collaborate with customers during the R&D phase to perform testing of chips while in wafer form, or wafer probing, in engineering test environments. Our engineering probe stations and analytical probes are used in research and development to perform precise electrical measurements, or electrical metrology, on increasingly complex and high-speed chips to assure quality and reliability, reduce costly redesigns, accelerate time-to-market and improve chip fabrication processes. By using our on-wafer probing solutions, design engineers can test and characterize circuits at the wafer level, before the ICs are diced and packaged. This cuts research and development times in half, and significantly reduces the tremendous cost of developing new chips.
3D Test Breakthroughs with IMEC
A fully-automatic test cell is developed to enable pre-bond probing of 3D chips with large-array fine-pitch micro-bumps.
Minimal Probe Scrub on ≤30 um Pads
True Kelvin CMOS test structure to achieve accurate and repeatable DC wafer-level measurements for device modelling applications.
Quick-turn EM Stress Correlates to Package-level Stress
Our work with Intel and Celadon shows advantages in time-to-data relative to standard package-level EM tests.
Every probe card project is unique to an individual IC design. So it’s critical that all aspects of the design and build are closely and collaboratively managed. That’s why our partnership with customers begins at the earliest design phase, when we collectively evaluate advanced packaging and wafer test feasibility for new IC designs. It’s a deep, proactive engagement geared to help customers extract and validate critical data earlier in the test process to improve yield management and dramatically shorten the time to volume production and revenue.
In 2017 FormFactor was selected to receive Texas Instruments’ highest level of supplier recognition, the 2016 Texas Instruments Supplier Excellence Award, given to a select few suppliers. “FormFactor has demonstrated exceptional commitment and capability to deliver the products we need and the performance we expect,” said Rob Simpson, vice president of Texas Instruments Worldwide Procurement and Logistics.
Production-level Testing of mmW Automotive Applications
See how to use a multi-DUT test approach to lower cost and get the most out of every test touchdown-even at millimeter-wave frequencies.
High-Bandwidth-Memory Drives Stringent Test Requirements
Learn about key electrical challenges, and view measurement data under various probing conditions.
Increase Testing Throughput on Automotive ICs
View demonstrated results on a tester platform with high parallelism (x95 DUT), a large active area, and a wide range of temperatures.