FormFactor PH-Series™ probe cards, available in probe head sizes ranging from 50 to 100mm, feature FormFactor’s ultra-precise MicroSpring contact technology, which enables advances in integrated, wafer testing thereby allowing manufacturers to significantly reduce total cost of ownership. FormFactor probe cards provide high test parallelism, with the ability to test greater than 256 die simultaneously. Leveraging this ability allows the test of a single 300 mm wafer in as few as six touchdowns.
PH product features include:
- 3D MEMS MicroSpring contact design with high pin count and small pad size capability
- Wide temperature compatibility for more controlled probing and faster setup, higher probe card availability and better test throughput
- Scalability to 50um pad pitch
- Improved planarization control for superior planarity