The latest DRAM chips deliver extremely fast and smooth graphic and cache memory response in game consoles and personal computers, as well as server applications.

They afford soaring memory capacity in smaller and smaller cellular phones, MP3 players and other consumer electronics, as semiconductors get stacked into compact packages of multi-tasking die. Testing these new, high-performance, high-density DRAM devices is optimized with FormFactor’s Matrix and PH-Series wafer probe cards as they improve efficiency and reduce the overall cost of DRAM test.

Every single bit must be tested to ensure top performance, making massively parallel wafer-level testing essential to high-yield, volume production at lower overall cost. FormFactor DRAM test solutions’ scalable architecture easily adapts to DRAM chip designs’ ultra-high pin count, wafer sizes and architecture, and makes optimal use of power and low-force, precision contact.

FormFactor DRAM wafer probe card capabilities include:

  • Three-dimensional MEMs probe spring design that supports fan-in and fan-out probe layout
  • Improved control over planarity
  • Industry leading TRE (Tester Resource Extension) Technology to maximize test parallelism
  • PH-Series™


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  • SmartMatrix™


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  • HFTAP™ (High Frequency<br>Testing at Probe)

    HFTAP™ (High Frequency
    Testing at Probe)

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