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ON-DEMAND WEBINARS

Single Sweep Broadband S-Parameter measurements for Semiconductor Transistor and IC Test to 220 GHz

Available for on demand viewing

With the growing demand for consumer devices working in the mm-wave range, including 5G/6G  and automotive radar, there is a growing need to enable measurements to go all the way to 220 GHz in a single sweep. Traditionally, measurements beyond conventional coaxial frequency limits often requires more than 1 measurement to cover the broader frequency range of interest, demanding the performance levels that are equivalent to conventional coaxial approaches.

In this webinar we will present a new optimized single sweep solution for S-parameters measurements from 900 Hz to 220 GHz.  We will also discuss recent developments of RF probes, instrumentation, calibration standards, and techniques that allow easy, accurate, repeatable, and trustworthy data.

Speakers

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Giancarlo De Chirico | RF Market Segment Director at FormFactor Inc.

Giancarlo De Chirico is the Director of Marketing for the RF Market in the Probe Systems Business Unit at FormFactor. He has 11 years of experience in network analysis and characterization of RF, microwave, and mm-wave devices. He has hosted numerous seminars and workshops on component characterization techniques.

Before joining FormFactor, Giancarlo served as a Director at Keysight Technologies and was responsible for the growth of the Aerospace & Defense Device/Component Test and Military ATE industries. He holds a Master's Degree in Electronics Engineering from Politecnico di Milano (Italy) and a Bachelor's Degree in Electronics Engineering from Politecnico di Bari (Italy).

Suren Singh | Technical Lead Emerging Technologies at Keysight Technologies

Suren Singh | Technical Lead Emerging Technologies at Keysight Technologies

Suren Singh received his BSEE from University of Durban-Westville, Durban South Africa in 1985. He completed a Graduate Diploma at the University of Witwatersrand, Johannesburg South Africa in December 1992. He then went on to complete his MSEE at the University of Witwatersrand, Johannesburg in 1995. Suren has been with the Hewlett-Packard Company, Agilent Technologies and now Keysight Technologies since 1986. His experience includes application engineering, product design, manufacturing, and test process development for microwave hybrid microcircuits. He also held the position of an application specialist and system architect, focused on the terahertz measurement solutions for Keysight. In addition, he is responsible for the metrology products for performance network analyzers, including both calibration and verification as applied to both ambient
and cryogenic temperatures. More recently Suren has been appointed as the technical lead for the emerging technologies for Quantum and 6G focused on the aerospace industry. More recently Suren has been involved in the development of solutions for cryogenic component testing for the Quantum based systems. He is also working closely with the industry leaders in millimeter wave space to bring to market solutions focused on 6G component characterization.

A Beginner's Guide to Quantum Computing

Available for on demand viewing

Quantum computing promises to revolutionize the way we address complex issues and deliver world-changing solutions in medicine, security, finance, defense, climate, energy, and more. Around the globe, governments, universities, and industry players of all sizes are investing tens of billions of dollars in the race to transform this amazing potential from theory into reality in the next few years.

In this webinar, authors Dr. Hiu Yung Wong and Dr. Zuyu Zhao will share their expertise in quantum computing. Attendees will learn:

  • What is quantum computing, and why do we need it?
  • How does quantum computing work (qubits, superposition, entanglement, programming)?
  • What challenges face this emerging industry today?
  • What critical technologies (such as ultra-cold cryogenics) enable quantum technology?

Twenty webinar attendees will be randomly chosen to receive one of their works, “Introduction to Quantum Computing, From a Layperson to a Programmer in 30 Steps,” (Dr. Hiu Yung Wong) or “Cryogenic Engineering and Technologies, Principles and Applications of Cryogen-Free Systems,” (Dr. Zuyu Zhao / Dr. Chao Wang).

Register today!

About the hosts:

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Dr. Zuyu Zhao, Chief Cryogenic Scientist, FormFactor, Inc.

Dr. Zuyu Zhao is Chief Cryogenic Scientist at FormFactor, having joined the company in June 2022 through the acquisition of JanisULT. Dr. Zhao has more than 25 years in the cryogenic field, with specialization in Dilution Refrigerators. Dr. Zhao joined Janis Research Company in 1993 and focused on developing custom ultra-low temperature facilities for the research and science community. He then served on the Board of Directors and as Vice President-Principal Scientist of the company. He also served from July 1, 2007 through June 30, 2013 as an elected member of the American Institute of Physics (Physics Today) Advisory Committee. Dr. Zhao received his B.S. degree from Fudan University in 1982, Class 77. He came to the United States in 1983 with the World Bank Scholarship program and graduated from Northwestern University with a Ph.D. degree of physics in 1990. He then spent two and a half years working at Harvard University as a post-doc and set up a new lab pursuing Bose-Einstein condensation on spin polarized hydrogen.

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Dr. Hiu Yung Wong, Assistant Professor and Silicon Valley AMDT Endowed Chair in Electrical Engineering, San Jose State University

Dr. Hiu Yung Wong is an Assistant Professor and Silicon Valley AMDT Endowed Chair in Electrical Engineering, San Jose State University. He received his Ph.D. degree in EECS from UC Berkeley in 2006. From 2006 to 2009, he worked as a Technology Integration Engineer in Spansion. From 2009 to 2018, he was a TCAD Senior Staff Application Engineer in Synopsys. He received the Curtis W. McGraw Research Award from ASEE Engineering Research Council in 2022, the NSF CAREER award and the Newnan Brothers Award for Faculty Excellence in 2021, and Synopsys Excellence Award in 2010. He is the author of the book, "Introduction to Quantum Computing: From a Layperson to a Programmer in 30 Steps". His research interests include the applications of machine learning in simulation and manufacturing, quantum computing, cryogenic electronics, reliability simulations, wide bandgap device simulations, and Design Technology Co-Optimization (DTCO). His works have produced one book, along with a book chapter, 90 papers, and 10 issued patents.

New Solutions for Analytical Wafer Probing of Silicon and Wide Band Gap Power Devices

Available for on demand viewing

The increasing use of electric vehicles, renewable energy sources, and other high-power industrial applications continues to drive the development of new high-voltage/high current semiconductor devices. While wide band gap (WBG) based devices have many advantages in high power circuits, time to market constraints often dictate the need to test these types of advanced devices on-wafer.

Wafer test of these power semiconductors poses unique challenges, as they often require test currents of more than 500 Amps, test voltages up to 10 Kilovolts and test temperatures up to 200° C. In addition, the wafer probing environment creates additional concerns such as the potential for electrical arcing, the need to minimize probe contact resistance to the DUT, and the requirement to maintain low contact and thermal resistance between the wafer and chuck.

This webinar will cover the basics of on-wafer power semiconductor device test, review the challenges listed above, and explain the solutions available to meet these challenges. After listening to this webinar attendees will have a much better understanding of the issues involved with testing advanced power devices on-wafer.

About the hosts:

Eric Wilcox

Eric Wilcox, Director, Marketing, DC and High-Power Market Segments, FormFactor, Inc.

Eric Wilcox is the Director of Marketing for FormFactor’s DC and High-Power Market Segments. Mr. Wilcox has held multiple organizational roles within the company, including Senior Marketing Manager for the Probe Systems business and Product Marketing Manager for the Reliability Test Systems business. Prior to this, Mr. Wilcox was a Senior Applications Engineer in the Center of Expertise at Cascade Microtech, Inc., and was responsible for the worldwide technical leadership of Reliability Test Products. Mr. Wilcox has co-authored multiple papers with industry experts about next generation reliability test methodologies for presentation at some of the premier IEEE reliability conferences and has obtained a US patent for innovative systems and methods of performing electromigration testing. Mr. Wilcox holds a Bachelor of Science in Business Management from the University of Northwestern – St. Paul.

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Alan Wadsworth, Business Development Manager at Keysight Technologies

Alan Wadsworth is the Americas region Business Development Manager for Precision and Power Products at Keysight Technologies. He has over 30 years of industry experience in both semiconductor design and test, and he is the author of both The Parametric Measurement Handbook and The New Power Handbook. Alan has Bachelor and Master of Science degrees in electrical engineering from the Massachusetts Institute of Technology and an MBA from Santa Clara University.

Superconductor and Spin Qubit Pre-Screening - Accelerate Quantum Development

Available for on demand viewing

FormFactor and Keysight invite you to learn how to speed development cycles for advanced quantum development. The companies have collaborated to develop an integrated measurement solution for pre-screening qubit devices at mK temperatures. The solution eliminates wire-bonding and packaging from cryogenic test processes to provide critical qubit performance parameters at 50 mK, enabling streamlined deployment in existing dilution refrigerators at 10 mK to reduce development cycle times by more than 2X. The turnkey measurement solution is fully optimized for qubit pre-characterization applications which removes the time-consuming process of selecting and integrating each individual piece of equipment.

Join this webinar to learn about:

  • Technologies being explored at 77K, 4K, and milli-Kelvin for deployment in a quantum computer
  • Challenges faced by researchers when performing cryogenic characterization measurements
  • The leading solutions to measure cryogenic device and circuit performance at the wafer-scale and chip-scale.

About the hosts:

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Jack DeGrave, Business Development Scientist in Quantum Technologies, FormFactor Inc.

Jack DeGrave joined the FormFactor-HPD Business Development team in early 2021 where he has focused on engaging with the Quantum Development Community members to map out the needs for cryogenic test and measurement, high density I/O device interfacing, and cryostats for deployment of quantum processors. His background in cryogenic test and measurement dates to early 2010 during his PhD studies in low temperature transport properties of helimagnets and skyrmions at the University of Wisconsin-Madison. After graduating, he held business development positions at several cryogenics companies. Jack brings greater than a decade of experience in cryogenic system design and test & measurement.

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Philip Krantz, Business Developer & Quantum Physicist, Quantum Engineering Solutions, Keysight Technologies

Philip is a Business Developer in the Quantum Engineering Solutions (QES) team at Keysight Technologies. In the team, he is working to expand the customer base of the quantum measurement software Labber, as well as providing hands-on expertise in quantum engineering. Philip is also the QES lead for customer and industry partnerships.

 

Prior to his appointment at Keysight, he received his PhD in experimental quantum physics at Chalmers University, in Sweden. He also spent three years as a post-doc in the Engineering Quantum Systems group at MIT, as well as two years as the scientific coordinator of the Wallenberg Centre for Quantum Technologies in Sweden.

Best Approaches for Sub THz Over Temperature Wafer Test

Available for on demand viewing

Wafer probing has been done for some time in waveguide at frequencies up to several hundreds of GHz. However solutions were typically limited by the constraints of large format extenders with large format positioners, which could limit the capabilities for over temperature work or RF performance.

Recent advances from Virginia Diodes Inc. and Formfactor, have allowed for solutions that allow optimal path lengths and the ability to isolate the extenders from elevated thermal temperatures while still also carrying out cold / dry / dark measurements.

In the talk we will discuss:

  • Latest solutions for optimal path length and over temperature capability
  • Best practices to optimise calibration and system drift
  • Use of Wincal as a tool to evaluate system performance
  • Autonomous RF to allow for fully automated calibration including Multiline TRL as well as automated device measurements over temperature at Sub THz frequencies
  • Real life measurement results

About the hosts:

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher is a member of the Centre of Expertise group at FormFactor, providing application support and technical services to FormFactor’s customers. With more than 2 decades of experience working with Cascade probe systems, and with his deep technical knowledge in a broad spectrum of applications such as high-frequency measurement, measurement automation, calibration and power device measurement, he educates and trains customers on best practices to achieve accurate measurement results. He has made several presentations at European Microwave Week, MOS-AK workshops, and Agilent/Keysight seminars.

Prior to joining FormFactor, Gavin served as a Mechanical Engineer at Alenia Marconi Systems. He holds an upper-second degree from Brunel University in Mechanical Engineering with electronic systems.

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Jeffrey Hesler, CTO & Owner, Virginia Diodes, Inc.

Jeffrey L Hesler is the CTO of Virginia Diodes and a visiting faculty at the University of Virginia. For more than 25 years he has worked to create new technologies that utilize the Terahertz (THz) frequency band for scientific, defense, and industrial applications. He has published over 200 technical papers, is a member of IEEE Technical Committee MTT-21 (THz Technology and Applications) and is a co-Editor of the IEEE Transactions on Terahertz Science and Technology. Terahertz systems based on his innovative designs are now used in hundreds of research laboratories throughout the world.

Strategies for Enabling Quantum Development with Test and Measurement from 77K down to milli-Kelvin

Available for on demand viewing

Quantum computing will likely utilize numerous new technologies which operate at different cryogenic temperatures. For example, a quantum computer might deploy CMOS memory modules at 77K, superconducting control chips at 4K, and a quantum processing unit (QPU) at less than 20 mK. To develop and deploy these various subsystems and technologies, it is vital to reliably and efficiently test and measure them at or near their operating temperatures.

Join this webinar to learn about:

  • Technologies being explored at 77K, 4K, and milli-Kelvin for deployment in a quantum computer
  • Challenges faced by researchers when performing cryogenic characterization measurements
  • The leading solutions to measure cryogenic device and circuit performance at the wafer-scale and chip-scale.

About the hosts:

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Jack DeGrave, Business Development Scientist in Quantum Technologies, FormFactor Inc.

Jack DeGrave joined the FormFactor-HPD Business Development team in early 2021 where he has focused on engaging with the Quantum Development Community members to map out the needs for cryogenic test and measurement, high density I/O device interfacing, and cryostats for deployment of quantum processors. His background in cryogenic test and measurement dates to early 2010 during his PhD studies in low temperature transport properties of helimagnets and skyrmions at the University of Wisconsin-Madison. After graduating, he held business development positions at several cryogenics companies. Jack brings greater than a decade of experience in cryogenic system design and test & measurement.

Thomas Funke - FormFactor, Inc.

Thomas Funke, Senior Manager, Cryogenic Systems Product Marketing

Thomas Funke is a senior manager for cryogenic systems product marketing at FormFactor. Prior to this he worked for 10 year in cryogenics as a Research Scientist and authored 13 publications about cryogenic engineering and thermal insulation.

Thomas is a 2006 graduate of Technische Universität Dresden in Mechanical Engineering. In 2020 he received a PhD in cryogenic hydrogen storage from the TU Dresden and joined FormFactor. Within this studies he spend 1 year at the Vibration and Acoustics laboratories at Virginia Tech where he worked on active noise cancellation and interior aircraft noise control.

Overcoming Challenges for Wafer-Level Low Frequency Noise Measurements

Available for on demand viewing

The development of next generation semiconductor device technology nodes targeted for communications, memory, imaging and various analog applications requires advanced wafer level low noise test and measurement capabilities. Flicker noise (1/f), random telegraph noise (RTN), and phase noise have been demonstrated to affect device behaviour and final circuit performance. In today's test labs, it is vital that test engineers are able to accurately measure the device or circuit noise characteristics in a quiet wafer test environment.  For this talk, we will first look at the different types of low frequency noise, how they are measured and their impact on devices as well as various circuit applications. We will also discuss the requirements of a quiet wafer test environment and the challenges of achieving one. Finally a wafer test solution that allows test engineers to make accurate low frequency noise measurements will be presented at the end of this talk.

About the hosts:

Dr Sia Choon Beng

Dr. Sia Choon Beng | Test Technologist at FormFactor Inc.

Dr. Choon Beng Sia is a SSG Fellow, conferred by the President of the Republic of Singapore. He is also a Nanyang Research Scholar and has received doctorate degree in Electronics Engineering from Nanyang Technological University, Singapore with 6 tier-1 journals & 3 conference papers published for his Ph.D. dissertation on RF Design, Characterization and Modelling of Silicon-based Devices.

In his current work at FormFactor as a Test Technologist, Dr Sia develops solutions to overcome semiconductor wafer test and measurement challenges. His research interests include design, test and modelling of silicon-based RF devices, THz calibration and measurements for 5G and IoT applications, photonics and power device wafer tests for LIDAR/Autonomous Transport/Optical communication applications as well as applying data analytics, deep learning and artificial intelligence to wafer tests and device modelling.

Dr. Sia serves in the IEEE MTT-3 technical committee focusing on developing standards and best practices for RF measurements, where he is also a member of the MTT-3 speaker bureau specializing in wafer RF and 5G tests. He lectures graduate-level semiconductor courses for IEEE and Singapore Semiconductor Industry Association. Through SPRING, the National Standards board, Dr. Sia represents Singapore as a Technical Expert in various IEC technical committees, developing standards for MEMs, optical and wafer-level reliability tests for semiconductor devices.

 

A wafer test, device modelling and process design kit (PDK) expert, Dr. Sia is often consulted by international semiconductor companies, defense, government and medical research institutes. He is a frequent invited speaker and organizer of IEEE workshops, international test forums and presently holds 12 international patents. Dr. Sia has published more than 50 scientific journals and conference publications, of which 85% of them as the first author. His technical papers on 5G production wafer test received multiple "Best Paper" awards and the "Best ATE Paper" award at the 2018, 2019 Semiconductor Wafer Test Conference and 2020 Test Vision Symposium, while his paper on Silicon Photonics wafer test received the "Most Inspirational Paper" award at the 2019 Semiconductor Wafer Test Conference.

RF Wafer Probing Fundamentals

Available for on demand viewing

An introduction to RF on-wafer probing and calibration. This webinar will expand your knowledge of techniques and tools available to properly characterize RF devices. The webinar is intended for persons interested in RF testing, with beginning knowledge of the physics and characteristics of RF semiconductors.

What you will learn:

  • Different RF probe architectures and how to choose the right probe for your application
  • On-wafer calibration: S-parameter basics, calibration methods and software
  • On-wafer measurement verification
  • Design For Testability
  • De-embedding
  • Temperature testing with RF probes
  • Probe cleaning

About the hosts:

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher is a member of the Centre of Expertise group at FormFactor, providing application support and technical services to FormFactor’s customers. With more than 2 decades of experience working with Cascade probe systems, and with his deep technical knowledge in a broad spectrum of applications such as high-frequency measurement, measurement automation, calibration and power device measurement, he educates and trains customers on best practices to achieve accurate measurement results. He has made several presentations at European Microwave Week, MOS-AK workshops, and Agilent/Keysight seminars.

Prior to joining FormFactor, Gavin served as a Mechanical Engineer at Alenia Marconi Systems. He holds an upper-second degree from Brunel University in Mechanical Engineering with electronic systems.

FRT Metrology for Advanced Packaging - Ensuring the highest quality control of grinding and dicing processes for DISCO Hi-Tec Europe

Available for on demand viewing

Advanced packages have enabled the industry to develop new flip-chip processes, 2.5D interposer and TSV technology, and 2D and 3D fan-out processes with high densities of connections in the smallest of spaces. With these new innovations, the need for flexibility in wafer metrology and handling has exploded. FormFactor MicroProf® AP metrology tools are specifically designed to address an extensive list of advanced packaging format and application challenges.

DISCO Hi-Tec Europe, a technological leader in grinding and dicing processes, will discuss how they perform advanced metrology using FormFactor FRT MicroProf® AP multi-sensor tools equipped with SurfaceSensTM technology to ensure the highest quality control of these processes.

Join us for this webinar to learn about:

  • Metrology applications in advanced packaging
  • Best practices and tips for grinding and dicing processes
  • How the FRT MicroProf® helps support the highest quality control of processes

About the hosts:

Bastian Tröger

Bastian Tröger | Team leader of Product Management and Field Application, FormFactor FRT Metrology

Team leader of Product Management and Field Application, FormFactor FRT Metrology

As a graduate engineer specializing in physical optics, he can look back on many years of professional experience in optical metrology.

His career at FRT started in 2007 in the development department, followed by the establishment of a new product management department and eventually led him to the management level of FormFactor FRT Metrology.

 

Dietmar Mayer

Dietmar Mayer | Manager of Dicing-Grinding Service, Disco Hi-Tec Europe GmbH

Manager of Dicing-Grinding Service, Disco Hi-Tec Europe GmbH

Dietmar started his career 1997 as a technician in the semiconductor field before he joined Disco Hi-Tec Europe GmbH in 2005.

He established an unique service solution in Dicing/Grinding/Polishing for semiconductor production worldwide as a supply chain partner for application support/improvement, prototype development or mass production.

 

Unattended RF Measurement and Calibration for 5G Device Characterization and More

Available for on demand viewing

New generations of 5G devices can have dozens of RF channels operating at high frequency, creating a need for a greater on wafer test volume. In engineering, more device tests are needed to support the expanded speed bands, increasing the workload to complete testing. How can test engineers manage the load? What if the probers could operate unattended -- start a test and measure during a whole shift, overnight, or even over the weekend? There is a real, hands-free solution that provides fast, accurate measurements with high throughput -- leading to more accurate design models and faster time to market.

Learn how an autonomous wafer probe system with integrated components from Keysight and FormFactor can:

  • Automatically perform wafer and die soaks to get the probes quickly to consistent operating temperature
  • Quickly and automatically clean probes and then calibrate at mmw frequencies without user input
  • Adjust automatically to multiple probe-to-probe spacings for different device geometries in a single test run
  • Monitor calibration drift and recalibrate on the fly when necessary
  • Work seamlessly for full temperature range -60 to 175C operation using N5291A Solution, from Keysight technologies, providing single sweep operation of 900 Hz to 130 GHz, and beyond this using Virginia diodes Waveguide mini modules and waveguide probes

About the hosts:

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher | Senior Applications Engineer at FormFactor Inc.

Gavin Fisher is a member of the Centre of Expertise group at FormFactor, providing application support and technical services to FormFactor’s customers. With more than 2 decades of experience working with Cascade probe systems, and with his deep technical knowledge in a broad spectrum of applications such as high-frequency measurement, measurement automation, calibration and power device measurement, he educates and trains customers on best practices to achieve accurate measurement results. He has made several presentations at European Microwave Week, MOS-AK workshops, and Agilent/Keysight seminars.

Prior to joining FormFactor, Gavin served as a Mechanical Engineer at Alenia Marconi Systems. He holds an upper-second degree from Brunel University in Mechanical Engineering with electronic systems.

Suren Singh | Technical Lead Emerging Technologies at Keysight Technologies

Suren Singh | Technical Lead Emerging Technologies at Keysight Technologies

Suren Singh received his BSEE from University of Durban-Westville, Durban South Africa in 1985. He completed a Graduate Diploma at the University of Witwatersrand, Johannesburg South Africa in December 1992. He then went on to complete his MSEE at the University of Witwatersrand, Johannesburg in 1995. Suren has been with the Hewlett-Packard Company, Agilent Technologies and now Keysight Technologies since 1986. His experience includes application engineering, product design, manufacturing, and test process development for microwave hybrid microcircuits. He also held the position of an application specialist and system architect, focused on the terahertz measurement solutions for Keysight. In addition, he is responsible for the metrology products for performance network analyzers, including both calibration and verification as applied to both ambient
and cryogenic temperatures. More recently Suren has been appointed as the technical lead for the emerging technologies for Quantum and 6G focused on the aerospace industry. More recently Suren has been involved in the development of solutions for cryogenic component testing for the Quantum based systems. He is also working closely with the industry leaders in millimeter wave space to bring to market solutions focused on 6G component characterization.

Delivering Advanced mm-Wave Load-Pull Measurements

Available for on demand viewing

The ramp-up of 5G mm-Wave technologies comes with substantial enhancements in connectivity, promising to revolutionize our world. A fundamental requirement of 5G devices is to maximize performance by optimizing the power and/or effciency of the amplifiers and transistors. This is done by measuring the performance characteristics of the device at different impedances that are systematically changed using load-pull tuners.

FormFactor has partnered with Focus Microwaves and Keysight Technologies to deliver a fully integrated probe solution for accurate on-wafer mm-Wave load-pull measurements, delivering a number of benefits along the way, including:

  • Low-Loss Measurement Channel for Maximized Tuning Range
  • Accurate Probing of Small Pads for High Resolution with a Perfect Fit
  • Coaxial Calibration with the Highest Phase Stability
  • EMI and light-tight testing at a wide temperature range, including tests down to -40°C without a build-up of frost and condensation.

About the hosts:

Anthony Lord | Director, RF Segment Business Development at FormFactor Inc.

Anthony Lord | Director, RF Segment Business Development at FormFactor Inc.

Anthony Lord is Director, RF Segment Business Development for FormFactor’s Systems Business Unit. Anthony has been involved in many organizational roles within the company, including applications engineering, sales management, product line management, strategic marketing as well as segment marketing, and has been actively involved in the semiconductor and RF industry for 24 years. Anthony has published several papers on RF on-wafer measurements, and has hosted numerous workshops and presentations on on-wafer test applications. Currently, Anthony is exploring where the RF semiconductor market is heading, and how to position future products to enable engineers to make the most accurate measurements with the fastest time to data.

 

Vince Mallette | Executive Vice President at Focus Microwaves

Vince Mallette | Executive Vice President at Focus Microwaves

Vince Mallette receieved his B.Sc from the University of Quebec - ETS in Montreal, Quebec, Canada in 2004. He has over 15 years of industry experience with Agilent (now Keysight), Focus Microwaves group pursuing product innovation, development and strategic business development. Currently he is the Executive Vice President of Focus Microwaves and heads all major business initiatives in terms of partnerships and growth on technology evaluation front. He has supported all different foundries ranging from silicon to III-V technologies from sub 6 GHz to mm-wave frequencies and innovation in tuner space from single frequency to harmonic tuner enabling high performance out of the device. He has authored and coauthored over 10 referred publications.

 

Advances in Analytical Wafer Probing of High-voltage / High-current Devices

Available for on demand viewing

With electric vehicles and other high-power applications gaining momentum, the development of new high-voltage/high current semiconductor devices is ramping up. Wafer test of these power semiconductors poses unique challenges, with test currents of more than 500 Amps and test voltages up to 10 Kilovolts. Designers of these new devices are pushing the limits of physics by shrinking the distance between contacts and requiring test temperatures up to 200° C.  In addition, new materials such as silicon carbide and gallium nitride are growing in popularity, adding new complexity to carry out testing in an environment that suppresses electrical arcing, provides low contact resistance of the probe to the device, and low contact and thermal resistance with uniformity between the wafer and chuck. Analytical and engineering probing is key in the research and development of these leading edge semiconductor technologies.

In this webinar, Rainer Gaggl, Founder and Managing Director of T.I.P.S. Messtechnik GmbH (specialists in the design and manufacturing of high-power wafer probe cards), and FormFactor’s Eric Wilcox, Director of Product Marketing, discuss these wafer test challenges and patented high voltage arc suppression technology that provides spark-free probing for high-voltage / high-current devices made with Si, SiC and GaN technology.

About the hosts:

Eric Wilcox

Eric Wilcox, Director, Marketing, DC and High-Power Market Segments, FormFactor, Inc.

Eric Wilcox is the Director of Marketing for FormFactor’s DC and High-Power Market Segments. Mr. Wilcox has held multiple organizational roles within the company, including Senior Marketing Manager for the Probe Systems business and Product Marketing Manager for the Reliability Test Systems business. Prior to this, Mr. Wilcox was a Senior Applications Engineer in the Center of Expertise at Cascade Microtech, Inc., and was responsible for the worldwide technical leadership of Reliability Test Products. Mr. Wilcox has co-authored multiple papers with industry experts about next generation reliability test methodologies for presentation at some of the premier IEEE reliability conferences and has obtained a US patent for innovative systems and methods of performing electromigration testing. Mr. Wilcox holds a Bachelor of Science in Business Management from the University of Northwestern – St. Paul.

Rainier Gaggl

Rainer Gaggl, Founder and Managing Director, T.I.P.S. Messtechnik GmbH

Rainer Gaggl is managing director of T.I.P.S. Messtechnik GmbH and responsible for product and process development as well as strategic sales activities. Mr. Gaggl founded T.I.P.S. in 1997 as a "spin-off" of Siemens Bauelemente; the company today has grown to a more than 80-person workforce headquartered in Villach, Austria. The main focus of his work is on test interfaces for high power devices, automotive ASICS, sensors and MEMS devices, and automotive RADAR. High voltage, high currents and probe cards with sensor stimuli are some of his "playgrounds as a physicist" and he holds several patents in that field. He holds a Ph.D. in Physics from the Technical University of Graz.

Scanning SQUID Microscopy – Eliminate the guesswork in the design of resilient superconducting circuits

Available for on demand viewing

FormFactor invites you to learn more about scanning SQUID microscopes – their history, applications, and the latest advances for superconducting quantum computing applications. Join IBM Research Division and Stanford University emeritus Dr. John Kirtley, a world-renowned expert who helped develop the technique of scanning SQUID microscopy, and FormFactor’s Dr. Ryan Murdick, Cryogenic Product Development Scientist, who collaborated on developing the industry’s first fully automated,  cryogen-free Scanning SQUID Microscope, the IQ1000.   By employing SQUIDs capable of magnetometry and susceptometry, the system allows measurements of local magnetization, magnetic response (susceptometry), and the ability to spatially map electrical currents from the magnetic response.  Researchers can now rapidly locate and capture detrimental magnetic vortices in superconducting circuits to enable operationally robust IC design and help accelerate the growth of the superconducting quantum computing market.

In this webinar, you will learn:

  • What is a scanning SQUID microscope?
  • Applications for scanning SQUID technology, and why it’s important for superconducting quantum IC design and characterization.
  • The latest advances from FormFactor IQ1000 to enable unattended and high-throughput magnetometry and susceptometry measurements including:
  • Automated, fast (five-minute) SQUID tuning
  • The ability to measure a large sample (20mm x 20mm) or nine samples (5mm x 5mm) simultaneously in one cool-down
  • Superb image quality scanning with sub-100 nm precision, as well as repeatable sub-space scanning and position hold for spectroscopy and vortex manipulation.
  • Sample temperature control from <3 K to over 20 K with precise, programmable heating and cooling rates.

About the hosts:

Prof. John Kirtley, Ph.D., consulting professor, Applied Physics Department, Stanford University

Prof. John Kirtley, Ph.D., consulting professor, Applied Physics Department, Stanford University

John Kirtley has worked in the fields of Surface Enhanced Raman scattering, light emissions from tunnel junctions and electron injection devices, noise in semiconducting devices, scanning tunneling microscopy and scanning SQUID microscopy. Since 2006 he has worked at the University of Twente in the Netherlands, been an Alexander von Humboldt Foundation Forschungspreis winner at the University of Augsburg in Germany, a Jubileum Professor at Chalmers University of Technology in Sweden, and currently holds a Chaire d'Excellence from the NanoSciences Fondation in Grenoble, France.

Kirtley shared the 1998 Oliver E. Buckley Prize with C.C. Tsuei, Donald Ginsberg, and D.J. van Harlingen. The citation was for "using phase-sensitive experiments in the elucidation of the orbital symmetry of the pairing function in high-Tc superconductors". Kirtley, Tsuei, and co-workers used scanning SQUID imaging of the half-integer flux quantum effect in tricrystal samples to demonstrate that cuprate high temperature superconductors have predominantly d-wave pairing symmetry. He received his BA in Physics in 1971 and his PhD in Physics in 1976, both from the University of California, Santa Barbara.

Ryan Murdick, Ph.D., Product Development Manager, FormFactor, Inc.

Ryan Murdick, Ph.D., Cryogenic Product Development Scientist, FormFactor, Inc.

Dr. Ryan Murdick has worked in cryogenic instrumentation for more than a decade; specifically, Scanning Probe Microscopy. He has built more than 25 custom SPM systems for cryogenic environments. Past employers include Montana Instruments and RHK Technology and he has consulted for Quantum Design, Prime Nano, and Molecular Vista. Dr. Murdick earned a PhD in Physics from Michigan State University in the field of Ultrafast Electron Diffraction and was a postdoctoral researcher at the University of Washington in the field of Nano Optics.

克服晶圆级低频噪声测量的挑战
Overcoming Challenges for Wafer-Level Low Frequency Noise Measurements*

Available for on demand viewing

The development of next generation semiconductor device technology nodes targeted for communications, memory, imaging and various analog applications requires advanced wafer level low noise test and measurement capabilities. Flicker noise (1/f), random telegraph noise (RTN), and phase noise have been demonstrated to affect device behaviour and final circuit performance. In today's test labs, it is vital that test engineers are able to accurately measure the device or circuit noise characteristics in a quiet wafer test environment.  For this talk, we will first look at the different types of low frequency noise, how they are measured and their impact on devices as well as various circuit applications. We will also discuss the requirements of a quiet wafer test environment and the challenges of achieving one. Finally a wafer test solution that allows test engineers to make accurate low frequency noise measurements will be presented at the end of this talk.

*This webinar will be presented in Chinese language.

About the host:

Dr Sia Choon Beng

Dr Sia Choon Beng | Test Technologist at FormFactor Inc.

Dr Choon Beng Sia is a SSG Fellow, conferred by the President of the Republic of Singapore. He is also a Nanyang Research Scholar and has received doctorate degree in Electronics Engineering from Nanyang Technological University, Singapore with 6 tier-1 journals & 3 conference papers published for his Ph.D. dissertation on RF Design, Characterization and Modelling of Silicon-based Devices.

In his current work at FormFactor as a Test Technologist, Dr Sia develops solutions to overcome semiconductor wafer test and measurement challenges. His research interests include design, test and modelling of silicon-based RF devices, THz calibration and measurements for 5G and IoT applications, photonics and power device wafer tests for LIDAR/Autonomous Transport/Optical communication applications as well as applying data analytics, deep learning and artificial intelligence to wafer tests and device modelling.

Dr Sia serves in the IEEE MTT-3 technical committee focusing on developing standards and best practices for RF measurements, where he is also a member of the MTT-3 speaker bureau specialising in wafer RF and 5G tests. He lectures graduate-level semiconductor courses for IEEE and Singapore Semiconductor Industry Association. Through SPRING, the National Standards board, Dr Sia represents Singapore as a Technical Expert in various IEC technical committees, developing standards for MEMs, optical and wafer-level reliability tests for semiconductor devices.

A wafer test, device modelling and process design kit (PDK) expert, Dr Sia is often consulted by international semiconductor companies, defence, government and medical research institutes. He is a frequent invited speaker and organizer of IEEE workshops, international test forums and presently holds 12 international patents. Dr Sia has published more than 50 scientific journals and conference publications, of which 85% of them as the first author. His technical papers on 5G production wafer test received multiple "Best Paper" awards and the "Best ATE Paper" award at the 2018, 2019 Semiconductor Wafer Test Conference and 2020 Test Vision Symposium, while his paper on Silicon Photonics wafer test received the "Most Inspirational Paper" award at the 2019 Semiconductor Wafer Test Conference.