DRAM
The latest DRAM chips deliver extremely fast and smooth graphic and cache memory response in game consoles and personal computers, as well as server applications.
They afford soaring memory capacity in smaller and smaller cellular phones, IOT and other consumer electronics, as semiconductors get stacked into compact packages of multi-tasking die. Testing these new, high-performance, high-density DRAM devices is optimized with FormFactor’s Matrix and PH-Series wafer probe cards as they improve efficiency and reduce the overall cost of DRAM test.
Flash
Fluctuating price and demand routinely require Flash memory manufacturers to find new operating efficiencies. FormFactor advanced wafer test solutions help manufacturers address that pressure, by improving yield and reducing overall cost of test per die.
Foundry & Logic
Wearables, smart phones and Internet of Things (IOT) are driving devices that are small, have high performance and long battery life. The logic chips used to drive these applications use advanced packaging technologies such as flip-chip, and wafer-level packaging in smaller form factor and higher electrical performance. Growing use of semiconductors in automobiles drive an increased need for reliability, safety and higher operating ranges than consumer devices. Apollo, Altius, Katana probe cards from Formfactor enable testing of logic devices at finer pitches, higher temperatures and increased parallelism to lower the cost of test and increased assurance to customer of delivery of a reliable product.
Parametric
Takumi™ probe cards for in-line and end-of-line parametric testing give IC manufacturers earlier insight into opportunities to validate their designs, verify process performance and achieve higher yields.
High contact precision supports manufacturers’ use of smaller test pads and narrower scribe lines on their product wafers.
RF / MMW / Radar
Production RF probe cards are rugged, robust, and well suited for the rigors of high-performance wafer sort. Their industry-leading signal integrity and mechanical capabilities make these probe cards the perfect fit for multi-die testing for RF wireless and high-speed digital in SiPs and SoCs.
