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FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from inspection and metrology, characterization, modeling, reliability, and design de-bug, to qualification and production test.

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200 mm Systems

Whatever the application - device characterization, modeling, process development, design de-bug or IC failure analysis, 200 mm manual and automated wafer probe stations have the precision and versatility needed for the most advanced semiconductor processes and aggressively scaled devices.

300 mm Systems

Cascade 300 mm probe stations set the standard for manual and automated on-wafer test, delivering the precision and versatility needed to address a wide range of advanced, complex testing requirements.

Autonomous Assistants

FormFactor’s Contact Intelligence technology combines smart hardware design and innovative software algorithms to provide accurate probe-to-pad alignment and electronic recalibrations in engineering labs and many production applications. FormFactor now has specialized Contact Intelligence assistants for autonomous RF, DC and Silicon Photonics (SiPh) testing.

Power Systems

The broad use of power semiconductors has created a pressing need to characterize power devices quickly and efficiently. FormFactor offers on-wafer power device characterization systems to reduce time-to-market for new power devices and to keep up with production.

Integrated Measurement Systems

FormFactor’s IMS products deliver robust, turn-key functionality, peace of mind, and a faster path to collecting high-quality on-wafer measurement data for today’s important and challenging test applications. Integrated Measurement Systems unite instruments and other products from FormFactor’s partners, including Keysight Technologies, along with FormFactor’s probe systems, probes, and everything else needed to deliver critical data for devices and integrated circuits on the wafer.

Wafer/Multi-chip Cryogenic Systems

Our high-performance cryogenic probe stations for on-wafer and multi-chip measurements support a wide range of challenging applications, including IR-sensor test, radiometric test, DC and RF measurements at cryogenic temperatures. The systems can handle wafers up to 300 mm, and support cold filter, cold shutter and selectable f/value aperture as well as multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated. Automatic chip alignment, OCR and wafer mark reading are exclusive features of our fully- and semi-automated systems. Cooling options include liquid helium (LHe), liquid nitrogen (LN2) or cryogen-free cooling. With a large install base of >80 stations worldwide, we bring expertise and technical know-how to provide the right solution for your measurement challenge.

Vacuum/Pressure Systems

Our vacuum and pressure probe stations for on-wafer measurements in a high vacuum or controlled pressure environment enable precise µ-bolometer test (un-cooled IR-FPA), MEMS characterization (inertial MEMS, resonators and RF MEMS, pressure sensors), IV/CV, RF/mmW and Opto measurements. Multiple optical instruments like IR radiation sources (black bodies), and up to eight probe positioners and/or a probe card can be integrated. The high stability design provides excellent contact quality and accurate measurement results in a condensation-free test environment. Step and repeat capability enables high throughput with our semi-automated systems.