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FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
Foundry & Logic
Wearables, smart phones and Internet of Things (IOT) are driving devices that are small, have high performance and long battery life. The logic chips used to drive these applications use advanced packaging technologies such as flip-chip, and wafer-level packaging in smaller form factor and higher electrical performance. Growing use of semiconductors in automobiles drive an increased need for reliability, safety and higher operating ranges than consumer devices. Apollo, Altius, Katana probe cards from Formfactor enable testing of logic devices at finer pitches, higher temperatures and increased parallelism to lower the cost of test and increased assurance to customer of delivery of a reliable product.
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Altius
Enables test of high performance very large I/O logic devices with fine pitch micro-bumps
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Kepler™
High parallelism, vertical probe card for automotive and industrial devices
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Apollo
Designed for fine-pitch flip-chip applications with high current carrying capability - copper pillar and solder bumps
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TrueScale
For advanced wire bond logic and SoC devices
Parametric
Takumi™ probe cards for in-line and end-of-line parametric testing give IC manufacturers earlier insight into opportunities to validate their designs, verify process performance and achieve higher yields. High contact precision supports manufacturers’ use of smaller test pads and narrower scribe lines on their product wafers.
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