Probe cards for wafer test of fine pitch, wire bonded logic devices
To meet consumer demand for portable computing products that are attractively priced, consume less power and offer “always on” connectivity, the semiconductor industry has stepped up with advances in process and packaging technologies.
While leading-edge semiconductor technologies deliver important advantages for low-cost and low-power applications, they present significant challenges for wafer testing. For example, wafer test faces stringent electrical performance requirements, and continued scaling in pad pitch, density and probe force, combine to lower cost and cycle-time trajectories to meet the demands of consumer-driven end markets.
FormFactor addresses these challenges with the industry’s broadest portfolio of non-memory wafer test probe cards offering high parallelism for greater throughput, stable contact resistance for optimal test yield, and superior contact precision. Through on-going investments in its technology, the company can quickly scale to meet customers’ future technical roadmap requirements for performance and geometry shrinks. FormFactor delivers a suite of advanced MEMS, vertical and cantilever probe cards.
Cantilever Key Features
- Supports 40 um pitch, 20/40 um staggered design
- Short-beam option for high speed testing, up to 3 GHz @-3 dB
- Uniform scrub performance for improved wire bond reliability