Making Wafer-Level Probe Solutions for Artificial Intelligence Possible
Artificial Intelligence (AI), once the stuff of science fiction movies, now comes in many guises, from personal assistants in cell phones to individualized movie recommendations to drone-based pipeline inspections, to name just a few.
AI’s neural networks learn in much the same way as their biological counterparts, through example and repetition rather than the sequential logic of standard computer programming. They include massive concentrations of interconnected nodes, each representing the equivalent of a single neuron. In essence, every node can be thought of as an independent algorithm, exchanging data with its peers as the network gains intelligence and arrives at solutions. In general, this process requires voluminous amounts of computing power to continually model the behavior of each node during each training cycle. All of which makes AI’s machine learning an ideal candidate for massive parallel processing.
Advanced AI Requires Advanced IC Packaging
Apollo Probe Card
|Apollo vertical probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip and pre-bump or aluminum pad application. Apollo is the industry-leading flip chip probe card of choice for graphics processors, game console microprocessors, and automotive microcontrollers. Leveraging proprietary manufacturing technology, Apollo delivers excellent reliability and quality for multi-DUT testing, and technology scalability to address a broad range of testing requirements.
• Broad range of vertical and vertical MEMS probe options, scalable to 80 um pitch
• Proprietary manufacturing technology for reduced CRES and improved wafer yield
• Superior current-carrying capability for enhanced production uptime and quick time-to-market
• Minimum grid-array pitch of 80 μm (or Minimum grid array pitch of 135μm)
• Supports high multi-site testing (X8–X16) with ultra high pin count (20 – 30k pins)
• Ultra low-force vertical MEMS probe options for Cu pillar probing, 1.5 to 2.5 g/probe
• Flip-chip bump or Cu pillar probing
• High current carrying option, up to 1A/probe
• Ultra-low force to allow high-temperature probing on solder-capped Cu pillars. <2 g/probe in production, demonstrated minimum solder cap disturbance post-probing to ensure back-end packaging reliability