Takumi™ probe cards for in-line and end-of-line parametric testing give IC manufacturers earlier insight into opportunities to validate their designs, verify process performance and achieve higher yields. High contact precision supports manufacturers’ use of smaller test pads and narrower scribe lines on their product wafers.
Takumi product capabilities include:
- Support 40um pad pitch, allowing room to produce more die per wafer
- Superior CRES performance for reliable parametric measurements
- Proprietary 3D MEMS MicroSpring contact for >1 Million TDs touchdown life-time