Leveraging Semiconductor Fabrication Processes and High-Volume Test to Advance Quantum Technologies

Over more than 60 years, the semiconductor industry has developed a structured approach to scaling complex technologies. This approach is grounded in well-defined fabrication processes, high-volume test, and tightly integrated design–fabrication–test cycles. Central to this discipline is the use of Process Design Kits (PDKs), which encapsulate device behavior, variability, and performance through models derived from large volumes of statistical data. These methodologies, along with rigorous testing and process control monitoring (PCM) at each stage of the manufacturing flow, have enabled predictable yield, rapid iteration, and continuous performance improvement. In contrast, many quantum technologies remain in the early stages of development, where limited datasets and low-throughput measurements constrain scalability. Extending wafer-level characterization into cryogenic environments leverages semiconductor industry processes to build predictive models and accelerate design cycles. Applying these proven techniques establishes a path for scaling quantum technologies toward commercial viability.