Amazing MEMS –
Innovative Technology Enables Advanced Wafer Test
The genius of MEMS (Micro-Electro-Mechanical Systems) is the heart of advanced probe cards, accounting for ~75% of the world’s advanced probe card market. MEMS technology provides a way to manufacture the probes, which contact the I/Os and power connections on ICs, at micron-level perfection. The precision of MEMS probes makes it ideal to support fine-pitch and high-pin count requirements of the leading-edge semiconductor process nodes and advanced packaging. But not all MEMS probes are created equal. Find out how FormFactor composite-metal MEMS technology is enabling a range of new ICs at the cutting edge of electronics innovations.
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PRESS RELEASE
New SmartMatrix™ 3000XP Probe Card Lowers DRAM Test Costs by More than 25%
SmartMatrix 3000XP provides 300 mm wafer testing for up to 3000 die simultaneously
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PRESS RELEASE
2020 THE BEST Suppliers Award
Customers Rate FormFactor One of THE BEST Suppliers in the Semiconductor Industry.
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NEWS ARTICLE
An Inside Look At Testing’s Leading Edge
FormFactor’s CEO Mike Slessor discusses AI, 5G and HBM test issues with Semiconductor Engineering.
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PRESS RELEASE
FormFactor Rated as Top Supplier of Semiconductor Probe Cards
Company Expands Leading Market Share, with Gains in High-growth Segments of the Probe Card Market
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PRESS RELEASE
FormFactor Introduces Edge Coupling Probe Solution for Silicon Photonics Devices
New Solution Features Die and Wafer-level Testing, In-situ Calibration and Integrated Test Automation Software from Keysight Technologies
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NEWS ARTICLE
Chiplet Momentum Rising
FormFactor’s CMO Amy Leong discusses discusses the need for "good enough die" at a reasonable test cost.
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PRESS RELEASE
FormFactor Introduces the Altius™ Vertical MEMS Probe Card for Advanced Packaging Technologies
Supports at-speed test of high bandwidth memory and verification of high-density interposers
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PRESS RELEASE
FRT is now a FormFactor company
Expands test and measurement leadership in high-growth Advanced Packaging and MEMS applications
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NEWS ARTICLE
Advanced Packaging, Heterogeneous Integration and Test
CEO Mike Slessor explains the groundswell of die-integration technologies that are revolutionizing packaging, assembly and test.
NEWS ARTICLE
Silicon Photonics: Automated wafer-level probing meets silicon photonics
FormFactor’s automated wafer probing systems enable Silicon Photonic chip designers to characterize and qualify their designs faster than ever.
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PRESS RELEASE
FormFactor Adds Second European Service Center
New service center opens in the key semiconductor manufacturing region of Grenoble, France.
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