Enabling GenAI Through Advanced MEMS Probe Card: Scaling HBM and Custom HBM Test for High-Temperature, Fine-Pitch, and μBump-Array Pad Applications

The growth of Generative AI is accelerating the evolution of High Bandwidth Memory (HBM) beyond traditional memory architectures toward highly customized solutions that integrate advanced logic base die, custom PHYs, workload-optimized memory controllers, and application-specific compute functions. As HBM technology scales from 1,024 to 4,096 I/Os, toward 16-Hi and 20-Hi stacks, and beyond 10 Gbps interface speeds, wafer test complexity is increasing dramatically across electrical, thermal, mechanical, and manufacturing domains.

This webinar examines the compute and memory architectural trends driving next-generation HBM and Custom HBM for GenAI applications and discusses how advanced MEMS probe card technologies enable reliable testing of these devices under increasingly challenging thermal, electrical, and mechanical conditions. Topics include high-speed testing at frequencies exceeding 5 GHz, testing under chuck temperatures exceeding 125°C, supporting high current-carrying requirements, and enabling reliable contact across dense pad arrays with probe counts exceeding 80,000 probes per DUT. We will discuss how increasing stack height, higher thermal dissipation, and logic-rich base die architectures create new requirements for probe planarity, contact resistance stability, thermal expansion management, and high-frequency signal integrity.

Join us for the first installment of a series of webinars to discover how FormFactor is advancing semiconductor test and enabling the silicon innovations that power the GenAI era.