Jason Alikpala, Sr. Staff Applications Engineer, FormFactor Inc.

To support the development of 6G and beyond mobile communication products, wafer S-parameters and RF measurements at sub-THz frequencies are becoming common, daily measurements for test engineers.  Accuracy, repeatability and traceability in tests, particularly for active devices, are necessary requirements as test engineers collaborate among their colleagues and customers in labs of various geographical locations. In this talk, based on published IEEE papers, we are going to discuss how probe tip power calibration, continuity checks in banded sub-THz measurements, probe tip contact resistance monitoring as well as best practices in autonomous over-temperature high frequency measurements, can help to address these evolving test requirements.

Jason is a senior applications engineer with over a decade of experience in RF and DC probes, probe control software and on-wafer calibration at FormFactor. He is an expert in modeling and characterization having led strategic planning and implementation of product releases while serving as R&D manager for Agilent and Hewlett Packard.

He holds a BS in electrical engineering from Cal State Polytechnic University at Pomona.