July 24, 2013
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013.
For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good die (KGD) or will “probably good die” suffice, given the cost of test?
Probe test companies, FormFactor and Microprobe were each working on TSV probe solutions independently. The companies recently merged, and have ramped up combined efforts, working with customers on wafer test strategy for 3D ICs. I met with Mike Slessor, Ph.D, Sr. VP and general manager, Microprobe Product Business Unit, Formfactor, to learn more about where they are taking these efforts.