September 30, 2014
The relentless drive for greater functionality and performance in smartphones, tablets and other consumer devices requires a higher level of chip integration, which in turn, requires increasing, which in turn, requires increasing the bump density in monolithic ICs.
he relentless drive for greater functionality and performance i n s m a r t p h o n e s , t a b l e t s and other consumer devices requires a higher level of chip integration, which in turn, requires increasing the bump density in monolithic ICs. As a result, scaling of flip-chip (FC) bump pitch is imperative in order to successfully connect all the I/Os on die, and to meet area and performance constraints.