Is Your Probe Closing the Eye? Evaluating Wafer-Probe Performance for 224G and 448G

As data rates move to 224G and toward 448G, wafer probing is no longer “just a contact problem.” The probe becomes part of the signal path, and its electrical and mechanical design can make or break measurement integrity at speed.

In this webinar, FormFactor shares how leading test teams should evaluate “high-speed” probe claims. Including:

Understand why 224G and 448G wafer probing requires treating the probe as part of the high-speed signal path.
Learn how probe architecture, geometry, contact resistance, force, and repeatability impact measurement integrity and channel correlation.
Evaluate “high-speed” probe claims with a practical checklist for performance, manufacturability, and production readiness.
See why purpose-built, short-path vertical MEMS probes set the benchmark for consistent, scalable results at next-generation data rates.

Attendees will leave with a practical checklist to qualify probe technologies with confidence—and a clear framework for selecting solutions that deliver repeatable, production-ready results at 224G today and 448G tomorrow.