FormFactor Expands Global Service and Support Infrastructure with new Europe Service Center
March 31, 2003
Center in Dresden will Reduce Total Cost of Ownership for FormFactor’s Mission-Critical Wafer Test Products
LIVERMORE, Calif. – March 31, 2003 — FormFactor, a leading provider of advanced wafer probe cards, today announced the opening of its Europe Service Center in Dresden, Germany. With this addition, FormFactor now has service operations located in North America, Asia and Europe, enabling faster response and repair times for the company’s growing installed base of wafer test products. FormFactor’s advanced wafer probe cards reduce capital equipment outlay and cost of test while increasing chip test capacity, volume and yield for semiconductor manufacturers.
The establishment of FormFactor’s Europe Service Center will further reduce the already low total cost of ownership (TCOO) for European companies that capitalize on FormFactor’s 200 mm or 300 mm wafer test technologies to optimize the semiconductor manufacturing process.
“FormFactor’s new Europe Service Center extends the reach of our service personnel and resources, enabling shorter time to resolution for our European customers,” said Stefan Zschiegner, senior director of FormFactor’s Solutions and Support Group. “This investment is yet another demonstration of our long-term commitment to meet our customers expectations for high availability of our mission-critical advanced wafer probing solutions.”
FormFactor’s Solutions and Support Group, created in 2002, operates a worldwide network of on-site support teams and regional service centers to provide ongoing assistance in support of the large installed base of the company’s wafer test products. This global support infrastructure helps reduce total cost of ownership of FormFactor’s products and enables FormFactor’s customers to meet critical production volume ramp milestones, optimize their wafer probe solutions, and minimize their time to resolution for repair and replacement issues.
FormFactor is a leader in DRAM, flash and microprocessor wafer probe cards, and is pursuing growth in Systems on IC wafer test. FormFactor’s advanced wafer probe cards detect and prevent defective chips from being assembled or packaged. The company’s MicroSpringTM interconnect technology and proprietary processes increase the testing capacity, volume, and yield of fabs, without requiring additional capital investment.