New FormFactor Probe Solution Dramatically Increases System-on-Chip Flip Chip Test Throughput
May 4, 2005
Wafer Test Device Debuts at Institute of Electrical and Electronics Engineers Conference on Very Large Scale Integration (VLSI) Test Performance
LIVERMORE, Calif. – May 4, 2005 –FormFactor, Inc. (Nasdaq: FORM) today announced delivery of it’s latest product for enabling breakthrough wafer test performance and throughput in the emerging System-on-Chip (SoC) flip chip market. FormFactor, a leading provider of advanced wafer probe cards, introduced the FormFactor BladeRunnerTM175 (BR175) Multi-DUT (Device Under Test) wafer probe card for flip chip logic, with DUT capabilities well in excess of any other product on the market. FormFactor’s latest solution significantly increases semiconductor manufacturers’ wafer test capacity and helps drastically reduce their total cost of test.
In addition to the emergence of SoC flip chip products, the 300 mm wafer format that is fast becoming the industry-standard more than doubles the number of die to be tested on flip chip device wafers and places significant demands and challenges on semiconductor manufacturers’ performance testing capabilities. With more than 10,000 probes enabling four-DUT testing and at least double the DUT capacity of the most advanced wafer probe product currently available, the FormFactor BR175 Multi-DUT wafer probe card tests considerably more flip chip devices in parallel, maximizing throughput and cost- effectiveness.
The FormFactor BR175 Multi-DUT wafer probe card is designed and manufactured to provide cost-effective testing functionality. The BR175 Multi-DUT card incorporates the Company’s proprietary MicroForceTM probing technology and probe planarity technologies which enable the testing of area array flip chip bumps with significantly reduced probe force, in turn minimizing the risk of cracking fragile inter-layer dielectric materials. FormFactor’s MicroForce probing technology has demonstrated superior product performance at customers’ production facilities, minimizing the re-sort rate and improving wafer sort yield of semiconductor manufacturers.
“Growing investment is driving innovation and expansion in the SoC flip chip market. FormFactor is leveraging the proven benefits of our single-DUT flip chip probe technology and our high parallelism expertise in memory test, and systematically delivering these advantages in multi-DUT SoC solutions that address customers’ need for cost-effective, high-performance test and increased wafer yields,” said Joe Bronson, president, FormFactor. “As we continue our transition to our new state-of-the-art manufacturing facility, we believe the BR175 Multi-DUT card will be an example of our ability to leverage the efforts of our advanced development line with our manufacturing capability to develop and deliver superior wafer test products and solutions.”