What’s really driving the next wave of semiconductor innovation—and why does test matter more than ever?

In this episode of the Semiconductor Leadership Podcast, Mike Slessor, President and CEO of FormFactor, shares insights on how AI, advanced packaging, and high-bandwidth memory (HBM) are reshaping the semiconductor value chain—and elevating the role of test and measurement.

From the growing complexity of HBM stacks to the emergence of co-packaged optics (CPO) and quantum computing, this conversation explores how FormFactor is solving some of the industry’s most challenging technical problems—while scaling operations to meet accelerating demand.

In this episode, we discuss:

• Why test is a critical driver of yield and system performance—not just quality control
• How AI and high-performance computing (HPC) are increasing test intensity and complexity
• The evolution from electrical to electro-optical testing in CPO and photonics
• What the transition from HBM3 to HBM4 means for probe card demand and economics
• Strategic decisions shaping FormFactor’s growth—from M&A to global supply chain shifts
• Leadership lessons from scaling a semiconductor company in a rapidly changing market

With over a decade leading FormFactor and a career spanning KLA and MicroProbe, Mike offers a candid perspective on decision-making, innovation cycles, and what it takes to build enduring technology leadership.

Whether you're an engineer, business leader, or industry observer, this episode offers a clear, inside look at where semiconductor test is headed next.