In Advanced Packaging new technologies were developed to achieve devices with high density in a small space, ultimately leading to "hybrid bonding" with even the highest density so far, which enables a higher bandwidth and an increased power. Currently, micro bumps and hybrid bonding are coexistent, as hybrid bonding is not required in all areas. In this regard, the need for flexibility in wafer metrology has just exploded in the past, and with new technologies and processes, it seems to keep growing even further and even faster.