FormFactor Executives Discuss IC Wafer Test Technologies and Trends at SEMICON West 2014
July 7, 2014
LIVERMORE, Calif. — July 7, 2014 —At SEMICON West this week in San Francisco, executives from FormFactor, Inc. (Nasdaq: FORM) will discuss the company’s newest wafer test technologies at a series of events and forums. SEMICON West is the premier annual conference and tradeshow for the global semiconductor manufacturing industry.
On Tuesday, FormFactor CEO Tom St. Dennis joins a panel of executives to discuss opportunities and challenges for test and packaging technology suppliers in the global marketplace. Moderated by Ron Leckie of Infrastructure Advisors, the panel is titled “Seeking Growth”. It will be held at TechXPOT North from 11:30am-12:30pm.
Test Vision 2020 happens on Wednesday and Thursday at the Marriott Marquis Hotel. Co-sponsored by FormFactor, this premier two-day program gathers executives, technologists and researchers throughout the semiconductor test ecosystem for discussions on IC wafer test trends and novel new technologies. FormFactor executives Amy Leong and Ben Eldridge will present a paper titled “2.5D / 3D wafer probe test challenges and solutions” on Thursday from 10:15-10:45am. Select products from FormFactor’s portfolio will be showcased at this venue.
Also on Wednesday, Tom St. Dennis and FormFactor President Mike Slessor will participate in the Sixth Annual CEO Investor Summit at the W Hotel.
Throughout the show, FormFactor executives will be on hand for customer meetings. To schedule a special briefing, please contact Lisa MacGregor at LMacGregor@formfactor.com.
SEMICON West showcases the world’s best technology companies from across the micro-electronics supply chain and beyond. More information can be found at www.semiconwest.org.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding anticipated results, market conditions or trends, expectations and operating plans. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: changes in the market demand for the company’s products; the company’s ability to timely develop and deliver products to test advanced memory and SoC devices; and the company’s ability to successfully service and collaborate with customers to assist them on improving their yield management and shorten the time to revenue. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company’s Form 10-K for the fiscal year ended December 28, 2013, as filed with the SEC, and subsequent SEC filings, including the company’s Quarterly Reports on Forms 10-Q. Copies of the company’s SEC filings are available at http://investors.formfactor.com. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.