FormFactor Enables 2.4Gb/s At-Speed Test Breakthrough for Mobile DRAM Testing
March 17, 2014
Multiple DRAM Suppliers Take Delivery of Advanced High-Frequency Probe Cards for Known Good Die Testing
LIVERMORE, Calif. — March 17, 2014 — FormFactor, Inc. (Nasdaq: FORM) today announced the release of its latest High Frequency Test-at-Probe (HFTAP) probe-card technology, which enables mobile DRAM wafer test speeds of up to 2.4Gb/s. This new capability allows at-speed wafer testing of the highest speed specification for LPDDR3 memories, providing manufacturers with full Known Good Die (KGD) test capability. Probe cards with this new technology were recently delivered to four suppliers of LPDDR3 mobile DRAM.
LPDDR2 and LPDDR3 are the memory technologies of choice for mobile devices like tablets and smart phones. They enable speedier data transfer and better multi-tasking performance than “standard” DRAM technology—with longer battery life through reduced power consumption. Deployment of the technology is increasing as DRAM manufacturers race to reduce mobile memory power consumption, even as memory arrays grow larger. Market research firm Gartner predicts that low-power mobile DRAM will account for over half of worldwide DRAM revenue by the end of 2014.*
FormFactor pioneered the capability of cost-effective at-speed-test probe cards when low-power SDRAM debuted more than a decade ago. Since then, the mobility-driven market trends of higher speeds with lower power consumption have imposed new performance demands on DRAM suppliers, resulting in ever-increasing test frequencies with reduced electrical test margins. FormFactor’s HFTAP probe cards are the first in the industry capable of meeting the new LPDDR3 at-speed-test requirements.
“Making probe cards that cost-effectively test today’s mobile DRAM chips is a natural extension of our HFTAP technology,” said Mike Slessor, FormFactor’s President. “Success in today’s mobile-driven semiconductor market requires close collaboration with both our DRAM customers and the ATE suppliers. By working together to match our technologies, we’ve been able to extend performance capabilities to enable Known-Good-Die testing of today’s high-end mobile DRAM parts.”
* Gartner “Forecast: DRAM Market Statistics, Worldwide, 2010-2017, 4Q13 Update”