FormFactor SmartMatrix 100XP Delivers Extended Performance for Next Generation DRAM Testing
June 8, 2011
Company also achieves 600th shipment milestone for Matrix probe card platform
LIVERMORE, Calif. – June 8, 2011 – FormFactor, Inc. (Nasdaq: FORM) today introduced the next generation of its SmartMatrix family of 300-mm full wafer contact probe cards for DRAM devices – the SmartMatrixTM 100XPTM probe solution. Built on the company’s proprietary
architecture that leverages its MicroSpring® 3D MEMS contact technology, the SmartMatrix 100XP probe card delivers new levels of performance that increase wafer test utilization and parallelism, and improves test yields, enabling customers to lower their test costs on leading- edge DRAM devices.
FormFactor’s SmartMatrix 100XP significantly increases probe card parallelism to over 850 die – a 60% increase from the SM100 platform, allowing single touchdown DRAM wafer test. Utilizing proprietary, custom IC’s, in combination with advanced MCM packaging, the SmartMatrix 100XP solution enhances tester resource sharing to increase the parallelism achievable from the test cell. SmartMatrix 100XP enables DRAM manufacturers and test service providers to increase test cell throughput on new test equipment, extend the life of their existing test equipment, and reduce their overall cost of test.
The SmartMatrix 100XP also improves high frequency signal fidelity during test. The company’s unique “DUTlet” or Device Under Test partitioned product architecture improves both signal integrity and power integrity, which are essential for low noise testing of 3X and 2X nm node low voltage LPDDR2 mobile and DDR3 commodity DRAM devices. With this capability, the new probe card enables higher test rates, thereby reducing overall test time. The improved signal fidelity also improves yields when testing advanced memory devices.
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Two other advanced features of the SmartMatrix 100XP are superior scrub performance for high probe count probe cards as compared to FormFactor’s previous generation products, and superior thermal performance. By allowing smaller and more controlled distribution of scrub marks across the wafer, the SmartMatrix 100XP reduces pad damage by as much as 15% — resulting in improved package test yields, enabling cost effective 3D packaging for Known Good Die (KGD) applications in the mobile market. The superior thermal performance of the Smart Matrix 100XP solution enables it to quickly reach and maintain test temperatures – improving throughput and extending uptime.
“DRAM manufacturers are looking to key suppliers to support their fast design ramps, advanced product roadmaps and stringent cost-of-test requirements,” said Glenn Farris, vice president of marketing at FormFactor. “Our SmartMatrix 100XP delivers new levels of performance to meet the needs for next generation DRAM testing, enabling manufacturers to stay on their test roadmaps and lower their cost of test.”
Company Reaches 600th Milestone with Matrix Family
FormFactor also announced it has achieved a milestone with this probing platform, marking the shipment of 600 units of its MatrixTM family advanced wafer probe cards. The family includes the TouchMatrix, TrueScale Matrix and SmartMatrix solutions used by IC manufacturers for full wafer-contact Flash, SOC and DRAM device testing. FormFactor’s Matrix family of probe cards enables customers to optimize tester utilization and improve yield thru superior uptime, contact accuracy and signal integrity. The 600th probe card was shipped to Hynix Semiconductor, one of the world’s leading memory manufacturers, where it is being used for next-generation DRAM testing.
“Hynix has made the transition to full wafer contact (FWC) wafer probe testing using the SmartMatrix product from FormFactor and has been able to achieve a very fast ramp for FWC testing, yielding lower cost though increases in parallelism and tester utilization,” said a senior Hynix spokesperson.
FormFactor’s SmartMatrix 100XP probe cards are now available.