FormFactor’s Harmony Architecture Sets the Stage for Innovation of Wafer Test Products
April 19, 2005
The New Harmony Architecture Delivers on Commitment to Reduce Total Cost of Test and Enables Future Migration to Single Touchdown Wafer Testing
LIVERMORE, Calif. – April 19, 2005 – Continuing its mission to lower the overall total cost of test, FormFactor, Inc. (Nasdaq: FORM), a leading provider of advanced wafer probe cards, today announced its new, proprietary “Harmony” architecture for wafer probe cards. The Harmony architecture addresses the significant challenges presented by the future demands of single touch down wafer probing and very high parallelism wafer test, and will be the key building block for FormFactor’s future generations of Flash, DRAM, Wafer Level Burn-in and High Frequency probing solutions.
“The Harmony architecture makes significant contributions toward our ability to deliver solutions to customers’ increasingly complex testing problems as wafer sizes increase and chip and pad sizes shrink. Very high parallel wafer test requires an architecture that performs consistently and predictably in a range of different test environments. Challenges in future full wafer testing include managing mechanical, thermal and materials compliance, while simultaneously enabling a very large area array probing solution populated with tens of thousands of geometrically precise contact structures that match the fine features of our customers’ devices,” said Ben Eldridge, FormFactor’s Chief Technology Officer. “The Harmony architecture is the result of our dedicated research and development efforts and extends FormFactor’s proven MicroSpring contact technologies and solutions to even higher device parallelism testing. We expect this architecture to ultimately enable single touchdown testing of wafers of any size.”
The first alpha product delivery incorporating the new Harmony architecture is a wafer probe solution for flash memory products and demonstrates significant advances in flash parallelism by enabling the simultaneous test of 792 chips. Like all FormFactor wafer test solutions, the alpha product incorporating the Harmony architecture leverages the Company’s proprietary MicroSpring interconnect technology and design processes and is made using micro-electro mechanical systems (MEMS), instead of the manual assembly typical of products from other manufacturers, ensuring highly repeatable, industry leading quality and performance.
“With the Harmony architecture we continue to demonstrate our ongoing commitment to increase our customers wafer test capacity while reducing their overall cost of test,” said Igor Khandros, CEO, FormFactor. “The exciting aspect of this architecture is in its potential to not only deliver many new innovative products to our customers, but to do so with much faster time to market performance due to the unique scalability towards very large active area probe arrays. With our new advanced development line devoted to leading edge technologies, and our new high volume production MEMS probe card factory, we are combining capabilities that are building on a decade of research and production expertise in MEMS-based wafer probing solutions, a combination that we believe is unique in our industry.”