Press Kit: Lab to Fab
When Market Pressures Demand the Shortest Possible Path from Concept to Volume Production
The pressure to bring products to market with no flaws, at the lowest cost, and at an accelerated pace puts focus directly on how products are tested throughout the flow of development through manufacturing.
As semiconductors move from the test lab to manufacturing, massive amounts of data must be extracted and analyzed to ensure ultimate success in the marketplace. It’s a process that starts before the first wafer is fabricated and continues all the way through final packaging. Each phase produces information vital to successive phases. What’s learned in the lab moves forward and becomes critical to efficiency on the production floor.
FormFactor has developed products and services that range from the “Lab”-- characterization, modeling, reliability, and design de-bug, to the “Fab,” -- where devices are qualified and tested in production. In this podcast, FormFactor’s CEO outlines how working across the range of test requirements is critical to optimize performance, reliability and yield.
Mike Slessor, CEO, FormFactor - April 2018
SmartMatrix™ 3000XP provides 300 mm full-wafer contact testing on mobile and commodity DRAM, graphic memory (GDDR), high bandwidth memory (HBM), and emerging memory devices. Specifically developed to support fast design ramps and advanced product roadmaps, this platform extends the production-proven Matrix™ architecture to address increased probe card parallelism in excess of 3000 sites per wafer…Read More