FormFactor Announces Breakthrough Test Technology
July 16, 2007
Future MEMS Contactors Will Enable Ultra Fine Pitch Wafer Probing
LIVERMORE, Calif. – July 16, 2007 – FormFactor, Inc. (Nasdaq: FORM) today announced that it has developed a breakthrough probing contact technology capable of full area wafer probing of high pin density, ultra fine pitch devices. Compared to today’s probing capabilities, FormFactor’s new technology will provide a 10x reduction in pitch (spacing between contacts), and potentially allow the probing of 1000x more contacts on a 300 mm wafer in a single touchdown. The new technology can be leveraged across memory, logic, SOC and parametric test applications, with either area array or peripheral test contacts.
“This fine-pitch full-wafer contactor technology is well suited to address the future testing needs of all semiconductor devices, without the trade off between testing pad pitch, density and throughput,” says Ben Eldridge, FormFactor’s chief technology officer. “This demonstration is another significant milestone in our strategy to develop complete product solutions with the most advanced technology available. FormFactor’s technology roadmap continues to stay ahead of our customers’ needs, enabling them to optimize design that can reduce their die size and maximize their test throughput.”
Following Moore’s Law, device die size has been continuously shrinking while the number of testing pads for new device function and performance has increased. In order to cope with this trend, semiconductor device designers will need to reduce the physical dimensions of the testing pads while maintaining high throughput. FormFactor’s new technology can reduce the contactor pitch for an area array from approximately 200 microns to less than 20 microns. The breakthrough technology, leveraging FormFactor’s leading MEMS expertise, employs a true vertical spring, improving contact precision well beyond existing capabilities. The spring has been demonstrated in FormFactor’s advanced development laboratory in Livermore, California.
The new MEMS contactor technology is anticipated to be commercially available within three to five years.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding the performance of our products. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward- looking statement due to various factors, including, but not limited to, the company’s ability: to develop a commercially available contactor incorporating the new probing contact technology; to introduce a commercial product that reduces the contactor pitch for an area array from a typical 200 microns to 20 microns; to leverage the new contact probing technology across memory, logic, SOC and parametric test applications, with either area array or peripheral test contacts; to introduce a product incorporating the new technology that meets customers’ needs and requirements. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company’s Form 10-K for the fiscal year ended December 30, 2006 and the company’s subsequent 10-Q and 8-K filings, which the company files with the Securities and Exchange Commission (“SEC”). Copies of the company’s SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in any forward-looking statements.