FormFactor Helps Lower Cost of Test for Advanced Automotive IC Applications
July 24, 2007
New fine pitch logic product provides high-temperature, high-parallelism testing for wire bond logic devices
LIVERMORE, Calif. – July 24, 2007 – FormFactor, Inc. (Nasdaq: FORM) today announced a new fine pitch logic product designed to address the unique testing requirements of wire bond logic and SOC devices. The new platform features the ability to reduce device pad pitch down to 60 microns, to increase the number of die tested in parallel (simultaneously) to x64, and test at temperatures up to 150 degrees C. All of these features are critical to ensuring the performance, quality and reliability of advanced automotive devices, and extend to broader wire bond logic applications.
“IC reliability and performance testing is especially critical in automotive applications, where semiconductors are used to control a variety of systems such as engine management components, active and passive safety systems, and other mechanisms,” said Igor Khandros, FormFactor’s chief executive officer. “Higher temperature testing at the wafer level helps ensure high reliability and assists manufacturers in achieving their goal of zero defects per million devices. This new product allows our customers to conduct these critical tests while leveraging our probe card’s ability to test more devices in parallel — improving test throughput and lowering the cost-of-test.”
Due to the constraints of conventional cantilever probing solutions, only a few logic devices can be tested in parallel today. As the number of electronic systems increase in automobiles, unit volumes per design and cost pressures are rising. In addition, the integration of Flash memory and other increased functionality is driving up test times for automotive devices—in some cases by an order of magnitude, from a few seconds to up to a few minutes or more. As a result, manufacturers are faced with a need for higher levels of test parallelism to reduce the cost of test.
FormFactor’s MEMS-based probe card with its scalable MicroSpring contact designs, allows for significantly higher pin counts and fewer touchdowns per wafer than alternative technologies. By testing more devices per wafer, chip manufacturers can also extend the life of their testing equipment, further extending their cost reduction benefits. FormFactor’s design roadmap for current MicroSpring technology will extend FormFactor’s pitch capability to smaller nodes in the near future.
The new product has been qualified at early adopter customers, with volume ramp anticipated in early 2008.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding business momentum, demand for our products and future growth. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: the demand for certain semiconductor devices; the company’s ability to deliver a fine pitch logic product that tests more devices (to x64) in parallel, has device pad pitch down to 60 microns, and can perform test at temperatures up to 150 degrees C; the company’s ability to deliver product consistent with a design roadmap to extend the company’s pitch capability to smaller nodes in the near future; the company’s ability to deliver product with significantly higher pin counts and fewer touchdowns per wafer than alternative technologies; whether customers adopt the company’s products and whether company’s realize improved test throughput and a lower cost of test. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company’s Form 10-K for the fiscal period ended December 30, 2006 and the company’s Form 10-Q for the quarterly period ended March 31, 2007, filed with the Securities and Exchange Commission (“SEC”), and subsequent SEC filings. Copies of the company’s SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward- looking statements.