FormFactor, Inc. Files Registration Statement for an Initial Public Offering
April 22, 2002
LIVERMORE, CA – April 22, 2002 – FormFactor, Inc. announced today that it has filed a Form S-1 registration statement with the U.S. Securities and Exchange Commission (SEC) for a proposed initial public offering of its common stock. The filing provides for an offering of up to $100 million of common stock. All shares are being offered by FormFactor.
FormFactor is the industry leader in the design, development, manufacture, sale and support of precision, high performance advanced semiconductor wafer probe cards. The company’s products are based on its proprietary MicroSpringTM interconnect technology, which enables FormFactor to produce wafer probe cards for test applications that require reliability, speed, precision and signal integrity.
Morgan Stanley will serve as lead managing underwriter of the offering, with Lehman Brothers, Banc of America Securities LLC and Thomas Weisel Partners LLC serving as co-managing underwriters.
A registration statement relating to these securities has been filed with the SEC but has not yet become effective. These securities may not be sold nor may offers to buy be accepted prior to the time the registration statement becomes effective. This news release shall not constitute an offer to sell or the solicitation of any offer to buy nor shall there be any sale of these securities in any state in which such an offer, solicitation or sale would be unlawful prior to the registration or qualification under the securities laws of any such state.
When available, a copy of the preliminary prospectus may be obtained from Morgan Stanley’s prospectus department at 1585 Broadway, New York, NY 10036-8200, (212) 761-6775.