FormFactor Ships Industry’s First 26,000 Pin-Count Wafer Probe Card
April 25, 2007
LIVERMORE, Calif. – April 25, 2007 – FormFactor, Inc. (Nasdaq: FORM) today announced a major milestone with the shipment of its first 26,000 pin-count wafer probe card, which is based on its new PH150XP platform. Representing the highest pin-count product manufactured and shipped by FormFactor to date, the wafer probe card will be used by Tera Probe Inc., a packaging and wafer test service provider, for production testing of its customers’ advanced DRAM wafers.
With the density and complexity of advanced ICs continuing to rise, improving test productivity has become increasingly critical to controlling test costs. FormFactor’s proprietary wafer probe card architecture and technologies enable the production of highly robust and ultra-high pin- count probe cards that allow IC manufacturers to test more devices simultaneously, or in parallel, on a wafer. This capability enables FormFactor’s customers to increase their test throughput with their existing capital equipment.
“With FormFactor products and solutions, IC manufacturers can test more die in parallel without compromising on performance. The result for our customers is the ability to significantly reduce their overall cost of test,” explained Igor Khandros, FormFactor’s chief executive officer. “We’re seeing a clear trend in the industry to increase the number of pins per chip in wafer test due to the increasing performance of and need for better power delivery to advanced devices. We’re pleased that Tera Probe will be using our high pin-count probe card to help meet its customers’ advanced DRAM production goals.”
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding the performance of our products. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward- looking statement due to various factors, including, but not limited to the company’s ability to: scale its products and solutions to meet customer needs and requirements, optimize DRAM wafer testing with its wafer test solutions; deliver to its customers wafer probe solutions that increase test throughput, provide higher productivity, and enable its customers to more fully utilize the resource capabilities of their latest-generation test equipment; and help its customers lower their overall cost of test. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company’s Form 10-K for the fiscal year ended December 30, 2006 and the company’s subsequent 10-Q and 8-K filings, which the company files with the Securities and Exchange Commission (“SEC”). Copies of the company’s SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in any forward-looking statements.