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TouchFusion™ is FormFactor’s newest 300 mm full-wafer contact testing solution for NAND Flash applications. This probe card enables single-touchdown testing for NAND Flash devices, supporting high pin counts to meet the industry’s demand for increased bit density and complexity. Higher pin counts improve power delivery for 3D NAND by allowing more power and ground connections.

Built on FormFactor’s proven 2D MEMS probe and space transformation technology, the TouchFusion platform ensures optimal CTE (coefficient of thermal expansion) matching across a wide temperature range, enabling precise probe placement and superior scrub performance. The probe card supports dual-temperature operation, ranging from -40°C to 130°C.

  • Increase throughput to test in excess of 35,000 probes
  • Test speeds of 125 MHz capable
  • Scalable 2D MEMS MicroSpring™ technology enables flexible pad layout with superior contact performance and long probe card lifetime
  • Excellent current carrying capacity
  • Fine pitch capability down to 70 μm
  • Capable to probe on 50 μm x 50 μm pads
  • Full wafer contactor architecture optimized for single- and dual-temperature designs
  • Excellent scrub mark position across wide temperature range
  • Superior thermal operation to shorten soak time and improve scrub performance