TouchFusion™
300 mm NAND Flash Probe Card Architecture
300 mm NAND Flash Probe Card Architecture
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Subscribe to Our NewsletterTouchFusion™ is FormFactor’s newest 300 mm full-wafer contact testing solution for NAND Flash applications. This probe card enables single-touchdown testing for NAND Flash devices, supporting high pin counts to meet the industry’s demand for increased bit density and complexity. Higher pin counts improve power delivery for 3D NAND by allowing more power and ground connections.
Built on FormFactor’s proven 2D MEMS probe and space transformation technology, the TouchFusion platform ensures optimal CTE (coefficient of thermal expansion) matching across a wide temperature range, enabling precise probe placement and superior scrub performance. The probe card supports dual-temperature operation, ranging from -40°C to 130°C.
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