Designed for pad testing of either fine-pitch wire-bond devices or pre-flip chip applications of logic devices
Katana probe card is designed to address challenging test requirements for industry leading Advanced Packages such as wire bond logic as well as pre-bump flip-chip applications. Applications include micro controllers, logic IC’s, automotive IC’s, touchscreen controllers & sensor IC’s. Katana can accommodate a variety of pad layout and is uniquely suited for use in a High Volume Manufacturing (HVM) environment with on-site individual pin replacement capability. The architecture is based on non-floating probe pins which enables stable Cres and thermal agility making it suitable for wide temperature range Testing (-40 to 140 deg).