Katana
Designed for pad testing of either fine-pitch wire-bond devices or pre-flip chip applications of logic devices
Katana Overview
Katana probe card is designed to address challenging test requirements for industry leading Advanced Packages such as wire bond logic as well as pre-bump flip-chip applications. Applications include micro controllers, logic IC’s, automotive IC’s, touchscreen controllers & sensor IC’s. Katana can accommodate a variety of pad layout and is uniquely suited for use in a High Volume Manufacturing (HVM) environment with on-site individual pin replacement capability. The architecture is based on non-floating probe pins which enables stable Cres and thermal agility making it suitable for wide temperature range Testing (-40 to 140 deg).
