We offer a complete line of premium performance analytical probe solutions for on-wafer probing, board test and package test that help increase process performance while reducing cost of ownership. Our probe systems are available with a complete set of accessories such as microscopes, thermal control systems, software and industry-leading probes.
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We offer more than 50 analytical probe models for wafer, package, and board level characterization. Our families of RF, mixed-signal and DC probes are designed to meet the challenges of a wide range of probing environments.
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We offer an extensive portfolio of high-performance probe cards for memory, RF, foundry and logic devices that help lower overall production costs, improve yields and enable “more-than-Moore” advanced packaging technologies.
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FormFactor supports customers throughout the entire design-to-production continuum, from characterization, modeling, reliability, and design de-bug, to qualification and production test.
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Our customers rely on our proven portfolio of products and our experienced engineers to help them meet today’s test and measurement challenges.
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Our probe systems help increase process
performance while reducing cost of ownership.
Our probe systems help increase process
performance while reducing cost of ownership.
Whatever the application - device characterization, modeling, process development, design de-bug or IC failure analysis, Cascade 200 mm wafer probing systems have the precision and versatility needed for the most advanced semiconductor processes and aggressively scaled devices.
