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FRT MicroProf® PT – A New Metrology and Inspection Solutions for Advanced Packaging

Fan-out panel level packaging is currently one of the latest assembly and packaging trends in the system-in-package world, meeting the increasing demands for extreme miniaturization and rising system requirements at reduced production costs.
This webinar will introduce a NEW solution- the FRT MicroProf® PT, a semiconductor metrology and inspection tool for rectangular panels up to 600 mm — containing 4-5X more dies compared to a 300 mm wafer and equipped with SurfaceSens™ technology.

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